33291 datasheet(4/27 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

33291

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 3. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Rating

Symbol

Value

Unit

Power Supply Voltage

Normal Operation (Steady-State)

Transient Conditions (1)

VPWR(SUS)

VPWR(PK)

-1.5 to 26.5

-13 to 60

Logic Supply Voltage (2)

VDD

-0.3 to 7.0

Input Pin Voltage (3)

VIN

-0.3 to 7.0

Output Clamp Voltage (4)

5.0 mA

≤ IOUT ≤ 0.5 A

VOUT(OFF)

45 to 65

Output Self-Limit Current

IOUT(LIM)

1.0 to 3.0

Continuous Per Output Current (4), (5)

IOUT(CONT)

500

ESD Voltage (6)

Human Body Model (7)

Machine Model (7)

VESD1

VESD2

±2000

±200

Output Clamp Energy (8)

ECLAMP

Recommended Frequency of SPI Operation

fSPI

3.0

MHz

Storage Temperature

TSTG

-55 to 150

°C

Operating Case Temperature

-40 to 125

°C

Operating Junction Temperature

-40 to 150

°C

Power Dissipation (

TA = 25°C) (9)

2.0

Peak Package Reflow Temperature During Reflow (10), (11)

TPPRT

Note 11.

°C

Notes

Transient capability with external 100

Ω resistor in series with VPWR pin and supply.

Exceeding these limits may cause a malfunction or permanent damage to the device.

Exceeding the limits on SCLK, SI, CS, SFPD, or RST pins may cause permanent damage to the device.

With output OFF.

Continuous output current rating so long as maximum junction temperature is not exceeded. Operation at 125

°C ambient temperature

will require maximum output current computation using package RθJA.

ESD data available upon request.

ESD1 testing is performed in accordance with the Human Body Model (CZAP = 200 pF, RZAP = 1500 Ω), ESD2 testing is performed in

accordance with the Machine Model (CZAP = 200pF, RZAP = 0 Ω).

Maximum output clamp energy capability at 150

°C junction temperature using a single non-repetitive pulse method.

Maximum power dissipation at indicated junction temperature with no heat sink used.

10.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

11.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.

MC33xxxD enter 33xxx), and review parametrics.

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