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34844 Datasheet(PDF) 32 Page - Freescale Semiconductor, Inc |
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34844 Datasheet(HTML) 32 Page - Freescale Semiconductor, Inc |
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32 / 37 page ![]() Analog Integrated Circuit Device Data 32 Freescale Semiconductor 34844 TYPICAL APPLICATIONS LAYOUT GUIDELINES LAYOUT GUIDELINES RECOMMENDED STACK-UP The following table shows the recommended layer stack- up for the signals to have good shielding and Thermal Dissipation. DECOUPLING CAPS It is recommended to place decoupling caps of 100pf at the beginning and at the end of any power signal traces to filter high frequency noise. Decoupling caps of 100pf should be also placed at the end of any long trace to cancel antenna effects on it. These caps should be located as closed as possible to the point to be decoupled and the connection to GND should be as short as possible. SM_BUS/I2C COMMUNICATION AND CLOCK SIGNALS (SDA, SCK AND CK) To avoid contamination of these signals by nearby high power or high frequency signals, it is a good practice to shield them with ground planes placed on adjacent layers. Make sure the ground plane is uniform through the whole signal trace length. Figure 19. Recommended shielding for critical signals. These signals shall not run parallel to power signals or other clock signals in the same routing layer. If they have to cross or to be routed close to a power signal, it is a good practice to trace them perpendicularly or at 45° on a different layer to avoid coupling noise. SWITCHING NODE (SWA & SWB) The components associated to this node must be placed as close as possible to each other to keep the switching loop small enough so that it does not contaminate other signals. However, care must be taken to ensure the copper traces used to connect these components together on this node are capable to handle the necessary current and voltage. As a reference, a 10mils trace with a thickness of 1 oz of copper is capable of handling one ampere. Traces for connecting the inductor, input and output caps should be as wide and short as possible to avoid adding inductance or resistance to the loop. The placement of these components should be selected far away from sensitive signals like compensation, feedback and internal regulators to avoid power noise coupling. COMPENSATION COMPONENTS Components related with COMP pin need to be placed as close as possibThe trace of the feedback signal (VOUT) should be routed perpendicularly or at 45° on a different layer to avoid coupling noise, preferably between ground or power planes. FEEDBACK SIGNAL The trace of the feedback signal (VOUT) should be routed perpendicularly or at 45° on a different layer to avoid coupling noise, preferably between ground or power planes. Figure 20. Feedback Signal Tracing Table 9. Layer Stacking Recommendations Stack-Up Layer 1 (Top) Signal Layer 2 (Inner 1) Ground Layer 3(Inner 2) Signal Layer 4 (Bottom) Ground Signal Ground Plane Ground Planes Signal DO S S Sw w wiiitttc cch hhiiin nng gg N N No ood dde ee IIIn nnp ppu uuttt C C Ca aap pp O O O u uutttp ppu uuttt C C Ca aap pp On State Off State C C Co oom m mp ppe een nns ssa aatttiiio oon nn F FFe eee eed ddb bba aac cc k kk S SSiiig ggn nna aalll |
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