PCF2123TS datasheet(44/54 Pages) NXP

44 / 54 page

PCF2123_1

Product data sheet

Rev. 01 — 19 November 2008

44 of 54

NXP Semiconductors

PCF2123

SPI Real time clock/calendar

14. Package outline

Fig 29. Package outline of PCF2123TS (SOT402-1)

UNIT

cD (1)

E (2)

(1)

eHE

LLp

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.72

0.38

0.13

0.1

0.2

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT402-1

MO-153

99-12-27

03-02-18

w M

b p

0.25

L p

detail X

(A )

v M A

2.5

5 mm

scale

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm

SOT402-1

max.

1.1

pin 1 index

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