15

3039K–CNFG–2/08

AT17F040/080

20. Packaging Information

20.1

8CN4 – LAP

TITLE

DRAWING NO.

GPC

REV.

Package Drawing Contact:

packagedrawings@atmel.com

8CN4

DMH

D

8CN4, 8-lead (6 x 6 x 1.04 mm Body),

Lead Pitch 1.27mm,

Leadless Array Package (LAP)

2/15/08

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

A

0.94

1.04

1.14

A1

0.30

0.34

0.38

b

0.45

0.50

0.55

1

D

5.89

5.99

6.09

E

5.89

5.99

6.09

e

1.27 BSC

e1

1.10 REF

L

0.95

1.00

1.05

1

L1

1.25

1.30

1.35

1

Note:

1. Metal Pad Dimensions.

2. All exposed metal area shall have the following finished platings.

Ni: 0.0005 to 0.015 mm

Au: 0.0005 to 0.001 mm

Pin1 Corner

Marked Pin1 Indentifier

0.10 mm

TYP

4

3

2

1

5

6

7

8

Top View

L

b

e

L1

e1

Side View

A1

A

Bottom View

E

D