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LTC4352 Datasheet(PDF) 12 Page - Linear Technology |
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LTC4352 Datasheet(HTML) 12 Page - Linear Technology |
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12 / 16 page ![]() LTC4352 12 4352f Figure 8. Recommended PCB Layout for Power MOSFET C1 S S S G D D D D DRAWING IS NOT TO SCALE! VIA TO GROUND PLANE LTC4352 MSOP-12 VIA TO GROUND PLANE CURRENT FLOW CURRENT FLOW WW TRACK WIDTH W: 0.03˝ PER AMPERE ON 1OZ CU FOIL FROM INPUT SUPPLY TO LOAD Q1 SO-8 4352 F08 APPLICATIONS INFORMATION LEDs, D1 and D2, require around 3mA for good luminous intensity. Accounting for a 2V diode drop and 0.5V VOL, R1 and R2 are set to 2.7k. PCB Layout Considerations Connect the VIN and OUT pin traces as close as possible to the MOSFET’s terminals. Keep the traces to the MOSFET wide and short to minimize resistive losses. The PCB traces associated with the power path through the MOSFET should have low resistance. See Figure 8. It is also important to put C1, the bypass capacitor for the VCC pin, as close as possible between VCC and GND. Also place C2 near the CPO and SOURCE pins. Surge suppressors, when used, should be mounted close to the LTC4352 using short lead lengths. |
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