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LTC3609 Datasheet(PDF) 18 Page - Linear Technology

Part # LTC3609
Description  32V, 6A Monolithic Synchronous Step-Down DC/DC Converter
PDF  24 Pages
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Manufacturer  LINER [Linear Technology]
Direct Link  http://www.linear.com
Logo LINER - Linear Technology

LTC3609 Datasheet(HTML) 18 Page - Linear Technology

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LTC3609
18
3609f
APPLICATIONS INFORMATION
Figure 6. Design Example: 5V to 32V Input to 2.5V/6A at 550kHz
VOUT
2.5V AT
6A
GND
VIN
VIN
5V TO 32V
COUT1
100μF
x2
L1
1.2μH
CIN
4.7μF
50V
x2
+
LTC3609
SGND
26
NC
25
NC
24
VFB
23
ION
22
NC
21
SGND
20
FCB
19
ITH
18
VRNG
17
PGOOD
16
SGND
15
SGND
GND
VOUT
1
2
3
4
5
6
7
SW
SW
SW
8
9 10 11
12 13 14
40 39 38 37 36 35 34 33
INTVCC
INTVCC
32
PGOOD
31
VIN
30 29 28 27
SW
41
SW
42
SW
43
SW
44
SW
45
SW
46
SW
47
PVIN
48
PVIN
49
PVIN
50
PVIN
51
PVIN
52
3609 F06
CF
0.1μF
50V
RF1
1Ω
CVCC
4.7μF
6.3V
EXTVCC
C4
0.01μF
INTVCC
INTVCC
JP1
CB1
0.22μF
DB
CMDSH-3
CSS
0.1μF
VIN
CVON
0.1μF
R1
9.53k
1%
RPG1
100k
RON
187k
1%
R2
30.1k
1%
R5
15.8k
CC1
1000pF
CC2
100pF
VOUT
CIN: MURATA GRM32ER71H475K
COUT: MURATA GRM435R60J107M
LI: CDEP851R2MC-50
KEEP POWER GROUND AND SIGNAL
GROUND SEPARATE. CONNECT AT
ONE POINT.
2Ω
• Use a compact plane for the switch node (SW) to improve
cooling of the MOSFETs and to keep EMI down.
• Use planes for VIN and VOUT to maintain good voltage
filtering and to keep power losses low.
• Flood all unused areas on all layers with copper. Flood-
ing with copper reduces the temperature rise of power
components. Connect these copper areas to any DC
net (VIN, VOUT, GND or to any other DC rail in your
system).
When laying out a printed circuit board without a ground
plane, use the following checklist to ensure proper opera-
tion of the controller. These items are also illustrated in
Figure 7.
• Segregate the signal and power grounds. All small
signal components should return to the SGND pin at
one point, which is then tied to the PGND pin.
• Connect the input capacitor(s) CIN close to the IC. This
capacitor carries the MOSFET AC current.
• Keep the high dV/dT SW, BOOST and TG nodes away
from sensitive small-signal nodes.
• Connect the INTVCC decoupling capacitor CVCC closely
to the INTVCC and PGND pins.
• Connect the top driver boost capacitor CB closely to
the BOOST and SW pins.
• Connect the VIN pin decoupling capacitor CF closely to
the VIN and PGND pins.



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