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LTC4110 Datasheet(PDF) 6 Page - Linear Technology |
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LTC4110 Datasheet(HTML) 6 Page - Linear Technology |
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6 / 52 page ![]() LTC4110 6 4110fa Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Specific functionality or parametric performance of the device beyond the limits expressly given in the Electrical Characteristics table is not implied by these maximum ratings. Note 2: The LTC4110E is guaranteed to meet performance specifications from 0°C to 85°C. Specifications over the –40°C to 85°C operating temperature range are assured by design, characterization and correlation with statistical process controls. Note 3: This IC includes overtemperature protection that is intended to protect the device during momentary overload conditions. Overtemperature protection will become active at a junction temperature greater than the maximum operating junction temperature. Continuous operation above the specified maximum operation temperature may result in device degradation or failure. Operating junction temperature TJ (in °C) is calculated from the ambient temperature TA and the average power dissipation PD (in watts) by the formula TJ = TA + θJA • PD. ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. Unless otherwise specified, VDCIN = VDCOUT = VDCDIV = 12V, VBAT = 8.4V, GND = SGND = CLP = CLN = SHDN = 0V and RVREF = 49.9k. All currents into device pins are positive and all currents out of device pins are negative. All voltages are referenced to GND, unless otherwise specified. Note 4: The LTC4110 is idle with no application load. It is not charging or calibrating the battery and is not in backup or shutdown mode. The internal clock is running and the SMBus is functional. Note 5: Combined current of CSP, CSN and BAT pins set to VBAT with no application load. Note 6: CTH is defined as the sum of capacitance on THA, THB SafetySignal. Note 7: Does not include tolerance of current sense or current programming resistors. Note 8: Given as a per cell voltage referred to the BAT pin (VBAT/number of series cells). Note 9: Refer to System Management Bus Specification, Revision 1.1, section 2.1 for Timing Diagrams and section 8.1, for tLOW and tTIMEOUT requirements. Note 10: Specifications over the –5°C to 85°C operating ambient temperature range are assured by design, characterization and correlation with statistical process controls. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VREMH THB Pin Battery Removal Threshold Hysteresis Voltage VTHB Decreasing; Lead Acid Only 25 mV Logic and Status Output Levels VILS SCL/SDA Input Pins Low Voltage l 0.8 V VIHS SCL/SDA Input Pins High Voltage l 2.1 V VOLS SDA Output Pin Low Voltage IPULL-UP = 350μA l 0.4 V VOLG ACPb, GPIO1,2,3 Output Pins Low Voltage IACPb, IGPIO1, IGPIO2, IGPIO3 = 10mA 1 V IOHG ACPb, GPIO1,2,3 Output Pins Open Leakage Current Outputs Open, VACPb, VGPIO1,2,3 = 5V –2 2 μA VILG GPIO Input Low Voltage l 1V VIHG GPIO Input High Voltage l 1.5 V VILSD SHDN Input Pin Low Voltage 0.5 V VIHSD SHDN Input Pin High Voltage 2.4 V IISD SHDN Input Pin Pull-Up Current VSHDN = 2.4V –3.5 –2 –1 μA TLR Logic Reset Duration After Power-Up From Zero VDCIN Transition From 0V to 5V in <1ms; VBAT = 0 1s SMBus Timing (Note 9) tHIGH SCL Serial Clock High Period IPULL-UP = 350μA, CLOAD = 250pF, RPU = 9.31k l 4μs tLOW SCL Serial Clock Low Period IPULL-UP = 350μA, CLOAD = 250pF, RPU = 9.31k l 4.7 μs tTO Timeout Period l 25 ms tF SDA/SCL Fall Time CLOAD = 250pF, RPU = 9.31k l 300 ns tSU-STA Start Condition Set-Up Time l 4.7 μs tHD-STA Start Condition Hold Time l 4μs tHD-DAT SDA to SCL Falling-Edge Hold Time, Slave Clocking in Data l 300 ns |
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