CD4066B

CMOS QUAD BILATERAL SWITCH

SCHS051D – NOVEMBER 1998 – REVISED SEPTEMBER 2003

3

POST OFFICE BOX 655303

–0.5 V to 20 V

. . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±10 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance,

80

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

M package

86

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

NS package

76

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PW package

113

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature (during soldering):

At distance 1/16

± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max

265

°C

. . . . . . . . . . . . . . . . . . . . . . .

–65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.

recommended operating conditions

MIN

MAX

UNIT

VDD

Supply voltage

3

18

V

TA

Operating free-air temperature

–55

125

°C