P308 datasheet(2/8 Pages) PHILIPS

2 / 8 page

P304_P308_P310G002_FAM_SDS_1

Product short data sheet

Rev. 01 — 29 July 2008

2 of 8

NXP Semiconductors

P304/P308/P310G002 family

Smart eID

1.3 Naming convention

1.4 Architecture overview

Every member of the Smart eID product family consists of hardware and software

components. The overall deliverable is a module for integration into a contactless smart

card or other contactless device. This module comes pre-conﬁgured with application

software and is ready to be personalized by NXP Semiconductors direct or indirect

customers.

1.4.1 Hardware platform

Every member of the Smart eID product family uses a proven, NXP-developed smart card

processor as the physical basis for its implementation. Chips are packaged in standard

modules ready to be bonded to an antenna coil and embedded in contactless cards.

NXP Semiconductors reserves the right to change aspects of manufacturing technology,

including, but not limited to: silicon chip design, silicon die size, choice of silicon

technology, silicon chip packaging. All aspects of the hardware platform relevant to NXP

Semiconductors direct or indirect customers are documented in the full data sheet and

other documents available for the Smart eID product family and its individual members.

Features

2.1 Standard family features

I EEPROM: choice of 4 KB, 8 KB, 10 KB

N Data retention time: 20 years minimum

N Endurance: 100 000 cycles minimum

I ISO/IEC 7816 LDS-compatible ﬁle system implementation supporting open access,

BAC and BAC plus operating modes

I Conﬁgurable authentication and security settings to match customer system

requirements

I Conﬁgurable access conditions for elementary ﬁles

I Possible activation of the UPDATE BINARY command in BAC plus operating mode

I Life cycle management system

I ISO/IEC 7816-4 compliant subset of the commands for ﬁle manipulation

I Proprietary commands for easier personalization and transport key exchange

I Flexible support for one ﬁxed functionality ID capable application

I Flexible ﬁle system based on ICAO LDS structure

Table 1.

Naming convention

P3xxG002zz Smart eID platform

amount of non-volatile memory in KB, increasing count for further product options

package type

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