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LTC2238 Datasheet(PDF) 21 Page - Linear Technology |
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LTC2238 Datasheet(HTML) 21 Page - Linear Technology |
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21 / 28 page ![]() LTC2238/LTC2237/LTC2236 21 223876fa Data Format Using the MODE pin, the LTC2238/LTC2237/LTC2236 parallel digital output can be selected for offset binary or 2’s complement format. Connecting MODE to GND or 1/3VDD selects offset binary output format. Connecting MODE to 2/3VDD or VDD selects 2’s complement output format. An external resistor divider can be used to set the 1/3VDD or 2/3VDD logic values. Table 2 shows the logic states for the MODE pin. APPLICATIO S I FOR ATIO Sleep and Nap Modes The converter may be placed in shutdown or nap modes to conserve power. Connecting SHDN to GND results in normal operation. Connecting SHDN to VDD and OE to VDD results in sleep mode, which powers down all circuitry including the reference and typically dissipates 1mW. When exiting sleep mode it will take milliseconds for the output data to become valid because the reference capacitors have to recharge and stabilize. Connecting SHDN to VDD and OE to GND results in nap mode, which typically dissipates 15mW. In nap mode, the on-chip reference circuit is kept on, so that recovery from nap mode is faster than that from sleep mode, typically taking 100 clock cycles. In both sleep and nap modes, all digital outputs are disabled and enter the Hi-Z state. Grounding and Bypassing The LTC2238/LTC2237/LTC2236 requires a printed cir- cuit board with a clean, unbroken ground plane. A multi- layer board with an internal ground plane is recom- mended. Layout for the printed circuit board should en- sure that digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track or underneath the ADC. High quality ceramic bypass capacitors should be used at the VDD, OVDD, VCM, REFH, and REFL pins. Bypass capaci- tors must be located as close to the pins as possible. Of particular importance is the 0.1 µF capacitor between REFH and REFL. This capacitor should be placed as close to the device as possible (1.5mm or less). A size 0402 ceramic capacitor is recommended. The large 2.2 µF ca- pacitor between REFH and REFL can be somewhat further away. The traces connecting the pins and bypass capaci- tors must be kept short and should be made as wide as possible. The LTC2238/LTC2237/LTC2236 differential inputs should run parallel and close to each other. The input traces should be as short as possible to minimize capacitance and to minimize noise pickup. Table 2. MODE Pin Function Clock Duty MODE Pin Output Format Cycle Stablizer 0 Offset Binary Off 1/3VDD Offset Binary On 2/3VDD 2’s Complement On VDD 2’s Complement Off Overflow Bit When OF outputs a logic high the converter is either overranged or underranged. Output Driver Power Separate output power and ground pins allow the output drivers to be isolated from the analog circuitry. The power supply for the digital output buffers, OVDD, should be tied to the same power supply as for the logic being driven. For example if the converter is driving a DSP powered by a 1.8V supply, then OVDD should be tied to that same 1.8V supply. OVDD can be powered with any voltage from 500mV up to 3.6V. OGND can be powered with any voltage from GND up to 1V and must be less than OVDD. The logic outputs will swing between OGND and OVDD. Output Enable The outputs may be disabled with the output enable pin, OE. OE high disables all data outputs including OF. The data ac- cess and bus relinquish times are too slow to allow the outputs to be enabled and disabled during full speed op- eration. The output Hi-Z state is intended for use during long periods of inactivity. |
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