TC254P

336-

× 244-PIXEL CCD IMAGE SENSOR

SOCS060B – JUNE 1997 – REVISED JULY 1998

Copyright

1

POST OFFICE BOX 655303

Sensor for Low-Cost Color TV Applications

Sensing Area

1/60–1/50000 s

Burn-In, Residual Imaging, Image

Distortion, Image Lag, or Microphonics

description

The TC254P is a frame-transfer charge-coupled device (CCD) designed for use in color NTSC TV and special-

purpose applications requiring low cost and small size.

The image-sensing area of the TC254P is configured in 243 lines with 336 elements in each line. Twelve

elements are provided in each line for dark reference. The blooming-protection feature of the sensor is based

on recombining excess charge with charge of opposite polarity in the substrate. This antiblooming is activated

by supplying clocking pulses to the antiblooming gate, which is an integral part of each image-sensing element.

The sensor can be operated in a non-interlace mode as a 324(H) by 243(V) square color pixel mode by

alternately averaging two red pixels for red pixels and two blue pixels for blue pixels. Because the human eye

is most sensitive to the green light wavelength, the 324

×243 resolution is preserved due to the orientation of

the green pixels in the Bayer mosaic color filter pattern.

The device can also be operated in a 162(H) by 121(V) square color pixel mode by utilizing a separate red, two

averaged greens, and a blue pixel for each color pixel. In this mode, true interlaced video is possible, effectively

increasing the vertical resolution, by performing a one pixel shift during the off-chip video processing.

One important aspect of this image sensor is its high-speed image-transfer capability. This capability allows for

an electronic shutter function comparable to interline-transfer and frame-interline-transfer sensors without the

loss of sensitivity and resolution inherent in those technologies.

This MOS device contains limited built-in gate protection. During storage or handling, the device leads should be shorted together

or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to SUB. Under no

circumstances should pin voltages exceed absolute maximum ratings. Avoid shorting OUTn to ADB during operation to prevent

damage to the amplifier. The device can also be damaged if the output terminals are reverse-biased and an excessive current is

allowed to flow. Specific guidelines for handling devices of this type are contained in the publication

Guidelines for Handling

Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments.

DUAL-IN-LINE PACKAGE

(TOP VIEW)

IAG2

ADB

SUB

OUT

ABG

IAG1

SAG

SRG

1

2

3

4

8

7

6

5

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.