TPS2211

SINGLE-SLOT PC CARD POWER INTERFACE SWITCH

FOR PARALLEL PCMCIA CONTROLLERS

SLVS156E – JULY 1997 – REVISED JANUARY 2001

3

POST OFFICE BOX 655303

TPS2211Y chip information

This chip, when properly assembled, displays characteristics similar to those of the TPS2211. Thermal

compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. The chips may be

mounted with conductive epoxy or a gold-silicon preform.

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

77

140

VCCD0

VCCD1

3.3V

3.3V

5V

5V

GND

OC

SHDN

VPPD0

VPPD1

AVCC

AVCC

AVCC

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

AVPP

12V

2

1

16

15

14

13

BONDING PAD ASSIGNMENTS

13

12

11

10

9

8

7

6

5

4

3

TPS2211Y