TPS75201Q, TPS75215Q, TPS75218Q, TPS75225Q, TPS75233Q WITH RESET

TPS75401Q, TPS75415Q, TPS75418Q, TPS75425Q, TPS75433Q WITH POWER GOOD

FAST-TRANSIENT-RESPONSE 2-A LOW-DROPOUT VOLTAGE REGULATORS

SLVS242B – MARCH 2000 – REVISED JUNE 2003

22

POST OFFICE BOX 655303

THERMAL INFORMATION

thermally enhanced TSSOP-20 (PWP – PowerPad

) (continued)

The thermal pad is directly connected to the substrate of the IC, which for the TPS752xxQPWP and

TPS754xxQPWP series is a secondary electrical connection to device ground. The heat-sink surface that is

added to the PWP can be a ground plane or left electrically isolated. In TO220-type surface-mount packages,

the thermal connection is also the primary electrical connection for a given terminal which is not always ground.

The PWP package provides up to 16 independent leads that can be used as inputs and outputs (Note: leads

1, 10, 11, and 20 are internally connected to the thermal pad and the IC substrate).

100

75

50

25

02

3

5

125

THERMAL RESISTANCE

vs

COPPER HEAT-SINK AREA

150

78

14

6

0.3

Natural Convection

50 ft/min

250 ft/min

300 ft/min

Copper Heat-Sink Area – cm2

100 ft/min

150 ft/min

200 ft/min

Figure 26