ISO1050 datasheet(11/21 Pages) TI

11 / 21 page

THERMAL CHARACTERISTICS

LIFE EXPECTANCY vs WORKING VOLTAGE

100

250

500

750

1000

– WorkingVoltage – V

IORM

880

120

at560V

IORM

28 Years

G001

ISO1050

www.ti.com............................................................................................................................................................... SLLS983A – JUNE 2009 – REVISED JULY 2009

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Low-K Thermal Resistance(1)

120

°C/W

Junction-to-air

High-K Thermal Resistance

73.3

°C/W

Junction-to-board thermal

Low-K Thermal Resistance

10.2

°C/W

resistance

Junction-to-case thermal resistance Low-K Thermal Resistance

14.5

°C/W

VCC1=5.5V, VCC2=5.25V, TA=105°C, RL= 60Ω,

Device power dissipation

TXD input is a 500kHz 50% duty-cycle square

200

wave

Tj shutdown

Thermal shutdown temperature(2)

190

°C

(1)

Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.

(2)

Extended operation in thermal shutdown may affect device reliability.

Figure 15. Life Expectancy vs Working Voltage

Submit Documentation Feedback

Product Folder Link(s): ISO1050

ISO1050 Datasheet(PDF) 11 Page - Texas Instruments

ISO1050 Datasheet(HTML) 11 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

Datasheet Download

Link URL