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PI2001 Datasheet(PDF) 14 Page - Vicor Corporation |
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PI2001 Datasheet(HTML) 14 Page - Vicor Corporation |
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14 / 23 page ![]() during MOSFET turn-off after a reverse current fault has been detected. In Active ORing applications when one of the input power sources is shorted, a large reverse current is sourced from the circuit output through the MOSFET. Depending on the output impedance of the system, the reverse current may reach over 60A in some conditions before the MOSFET is turned off. Such high current conditions will store energy even in a small parasitic element. For example, a 1nH parasitic inductance with 60A reverse current will store 1.8µJ (½Li 2). When the MOSFET is turned off, the stored energy will be released and will produce high negative voltage ringing at the MOSFET source. This event will create a high voltage difference across the drain and source of the MOSFET. The MOSFET current rating and maximum power dissipation are closely related. Generally the lower the MOSFET Rds(on), the higher the current capability and the lower the resultant power dissipation. This leads to reduced thermal management overhead, but will ultimately be higher cost compared to higher Rds(on) parts. It is important to understand the primary design goal objectives for the application in order to effectively trade off the performance of one MOSFET versus another. Power dissipation in active ORing circuits is derived from the total source current and the on-state resistance of the selected MOSFET. MOSFET power dissipation: ) ( 2 on Rds Is Pd MOSFET ∗ = Where : Is : Source Current Rds(on) : MOSFET on-state resistance Note: In the calculation use Rds(on) at maximum MOSFET temperature because Rds(on) is temperature dependent. Refer to the normalized Rds(on) curves in the MOSFET manufacturers datasheet. Some MOSFET Rds(on) values may increase by 50% at 125°C compared to values at 25°C. The Junction Temperature rise is a function of power dissipation and thermal resistance. ) ( 2 on Rds Is Rth Pd Rth Trise JA MOSFET JA MOSFET ∗ ∗ = ∗ = , Where: JA Rth : Junction-to-Ambient thermal resistance Rds(on) and PI2001 sensing: The PI2001 senses the MOSFET source-to-drain voltage drop via the SP and SN pins to determine the status of the current through the MOSFET. When the MOSFET is fully enhanced, its source-to-drain voltage is equal to the MOSFET on-state resistance multiplied by the source current, VSD = Rds(on)*Is. The reverse current threshold is set for -6mV and when the differential voltage between the SP & SN pins is less than -6mV, i.e. SP-SN ≤-6mV, the PI2001 detects a reverse current fault condition and pulls the MOSFET gate pin low, thus turning off the MOSFET and preventing further reverse current. The reverse current fault protection disconnects the power source fault condition from the redundant bus, and allows the system to keep running. The GATE pin output voltage is clamped to 10.5V maximum with respect to the SP pin, which should be tied to the MOSFET source pin, to support any MOSFET with a Vgs rating of ±12V or greater. A Vgs rating ≥12V is very common for industry standard N- Channel MOSFETs. OV/UV resistor selection: The UV and OV comparator inputs are used to monitor the input voltage and will indicate a fault condition when this voltage is out of range. The UV and OV pins can be configured in two different ways, either with a divider on each pin, or with a three- resistor divider to the same node, enabling the elimination of one resistor. Under-Voltage is monitored by the UV pin input and Over-Voltage is monitored with the OV pin input. The Fault pin ( FT ) will indicate a fault (active low) when the UV pin is below the threshold or when the OV pin is above the threshold. The UV and OV thresholds are 0.50V typ with 25mV hysteresis and their input current is less than ±1µA. It is important to consider the maximum current that will flow in the resistor divider and maximum error due to UV and OV input current. Set the resistor current to 100µA or higher to maintain 1% accuracy for UV and OV due to the bias current. The three-resistor voltage divider configuration for both UV and OV to monitor the same voltage node is shown in figure 13: Ra TH I OV V Ra ) ( = Figure 13: UV & OV three-resistor divider configuration. Picor Corporation • picorpower.com PI2001 Rev 1.0 Page 14 of 23 |
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