SX1213 datasheet(2/65 Pages) SEMTECH

2 / 65 page

SX1213

ADVANCED COMMUNICATIONS & SENSING

Rev.2 – July 1

st, 2009

Page 2 of 65

www.semtech.com

Table of Contents

1. General Description ................................................................... 5

1.1. Simplified Block Diagram................................................... 5

1.2. Pin Diagram ....................................................................... 6

1.3. Pin Description................................................................... 7

2. Electrical Characteristics............................................................ 8

2.1. ESD Notice ........................................................................ 8

2.2. Absolute Maximum Ratings............................................... 8

2.3. Operating Range ............................................................... 8

2.4. Chip Specification.............................................................. 8

2.4.1. Power Consumption.................................................. 8

2.4.2. Frequency Synthesis................................................. 9

2.4.3. Receiver .................................................................. 10

2.4.4. Digital Specification................................................. 11

3. Architecture Description........................................................... 12

3.1. Power Supply Strategy .................................................... 12

3.2. Frequency Synthesis Description .................................... 13

3.2.1. Reference Oscillator................................................ 13

3.2.2. CLKOUT Output ...................................................... 13

3.2.3. PLL Architecture...................................................... 14

3.2.4. PLL Tradeoffs.......................................................... 14

3.2.5. Voltage Controlled Oscillator................................... 15

3.2.6. PLL Loop Filter........................................................ 16

3.2.7. PLL Lock Detection Indicator .................................. 16

3.2.8. Frequency Calculation ............................................ 16

3.3. Receiver Description........................................................ 18

3.3.1. Architecture ............................................................. 18

3.3.2. LNA and First Mixer ................................................ 19

3.3.3. IF Gain and Second I/Q Mixer................................. 19

3.3.4. Channel Filters ........................................................ 19

3.3.5. Channel Filters Setting in FSK Mode ...................... 20

3.3.6. Channel Filters Setting in OOK Mode ..................... 21

3.3.7. RSSI ........................................................................ 21

3.3.8. Fdev Setting in Receive Mode ................................ 23

3.3.9. FSK Demodulator.................................................... 23

3.3.10. OOK Demodulator................................................. 23

3.3.11. Bit Synchronizer .................................................... 26

3.3.12. Alternative Settings ............................................... 27

3.3.13. Data Output ........................................................... 27

4. Operating Modes...................................................................... 28

4.1. Modes of Operation ......................................................... 28

4.2. Digital Pin Configuration vs. Chip Mode .......................... 28

5. Data Processing....................................................................... 29

5.1. Overview.......................................................................... 29

5.1.1. Block Diagram ......................................................... 29

5.1.2. Data Operation Modes ............................................ 29

5.2. Control Block Description ................................................ 30

5.2.1. SPI Interface ........................................................... 30

5.2.2. FIFO ........................................................................ 32

5.2.3. Sync Word Recognition........................................... 34

5.2.4. Packet Handler........................................................ 35

5.2.5. Control..................................................................... 35

5.3. Continuous Mode ............................................................ 36

5.3.1. General Description .................................................36

5.3.2. Rx Processing ..........................................................37

5.3.3. Interrupt Signals Mapping ........................................37

5.3.4. uC Connections........................................................38

5.3.5. Continuous Mode Example ......................................38

5.4. Buffered Mode ..................................................................39

5.4.1. General Description .................................................39

5.4.2. Rx Processing ..........................................................39

5.4.3. Interrupt Signals Mapping ........................................40

5.4.4. uC Connections........................................................41

5.4.5. Buffered Mode Example...........................................41

5.5. Packet Mode.....................................................................42

5.5.1. General Description .................................................42

5.5.2. Packet Format..........................................................42

5.5.3. Rx Processing ..........................................................44

5.5.4. Packet Filtering ........................................................44

5.5.5. DC-Free Data Mechanisms......................................46

5.5.6. Interrupt Signal Mapping ..........................................47

5.5.7. uC Connections........................................................47

5.5.8. Packet Mode Example .............................................48

5.5.9. Additional Information ..............................................48

6. Configuration and Status Registers ..........................................49

6.1. General Description..........................................................49

6.2. Main Configuration Register - MCParam..........................49

6.3. Interrupt Configuration Parameters - IRQParam ..............51

6.4. Receiver Configuration parameters - RXParam ...............53

6.5. Sync Word Parameters - SYNCParam.............................54

6.6. Oscillator Parameters - OSCParam .................................55

6.7. Packet Handling Parameters – PKTParam ......................56

7. Application Information .............................................................57

7.1. Crystal Resonator Specification .......................................57

7.2. Software for Frequency Calculation .................................57

7.2.1. GUI...........................................................................57

7.2.2. .dll for Automatic Production Bench .........................57

7.3. Switching Times and Procedures .....................................57

7.3.1. Optimized Receive Cycle .........................................58

7.3.2. Receiver Frequency Hop Optimized Cycle ..............59

7.4. Reset of the Chip..............................................................60

7.4.1. POR .........................................................................60

7.4.2. Manual Reset ...........................................................60

7.5. Reference Design.............................................................61

7.5.1. Application Schematic..............................................61

7.5.2. PCB Layout ..............................................................61

7.5.3. Bill Of Material..........................................................62

7.5.4. Ordering Information for Tools .................................63

8. Packaging Information ..............................................................63

8.1. Package Outline Drawing .................................................63

8.2. PCB Land Pattern.............................................................64

8.3. Tape & Reel Specification ................................................64

9. Revision History ........................................................................65

10. Contact Information.................................................................65

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