ADP2118 datasheet(5/24 Pages) AD

5 / 24 page

ADP2118

Rev. 0 | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN, PVIN

−0.3 V to +6 V

FB, SYNC/MODE, EN, TRK, FREQ, PGOOD

−0.3 V to +6 V

PGND to GND

−0.3 V to +0.3 V

Operating Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

Unit

16-Lead LFCSP_WQ

38.3

°C/W

Boundary Conditions

θJA is measured using natural convection on a JEDEC 4-layer

board, and the exposed pad is soldered to the printed circuit

board with thermal vias.

ESD CAUTION

ADP2118 Datasheet(PDF) 5 Page - Analog Devices