ADP2118 datasheet(21/24 Pages) AD

21 / 24 page

ADP2118

Rev. 0 | Page 21 of 24

OUTLINE DIMENSIONS

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGC.

0.65

BSC

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

0.50

0.40

0.30

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

PIN 1

INDICATOR

0.35

0.30

0.25

2.60

2.50 SQ

2.40

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 50. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

4 mm × 4 mm Body, Very Very Thin Quad

(CP-16-26)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Output Voltage

Package Description

Package Option

ADP2118ACPZ-R71

−40°C to +125°C

Adjustable

16-Lead LFCSP_WQ

CP-16-26

ADP2118ACPZ-1.0-R71

−40°C to +125°C

1.0 V

16-Lead LFCSP_WQ

CP-16-26

ADP2118ACPZ-1.2-R71

−40°C to +125°C

1.2 V

16-Lead LFCSP_WQ

CP-16-26

ADP2118ACPZ-1.5-R71

−40°C to +125°C

1.5 V

16-Lead LFCSP_WQ

CP-16-26

ADP2118ACPZ-1.8-R71

−40°C to +125°C

1.8 V

16-Lead LFCSP_WQ

CP-16-26

ADP2118ACPZ-2.5-R71

−40°C to +125°C

2.5 V

16-Lead LFCSP_WQ

CP-16-26

ADP2118ACPZ-3.3-R71

−40°C to +125°C

3.3 V

16-Lead LFCSP_WQ

CP-16-26

1 Z = RoHS Compliant Part.

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