SE97 datasheet(37/53 Pages) NXP

Part #	SE97

Description	DDR memory module temp sensor with integrated SPD, 3.3 V

PDF	53 Pages

Scroll/Zoom	100%

Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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37 / 53 page

SE97_6

Product data sheet

Rev. 06 — 17 August 2009

37 of 53

NXP Semiconductors

SE97

DDR memory module temp sensor with integrated SPD, 3.3 V

11. Characteristics

Table 28.

SE97 thermal sensor characteristics

VDD = 3.0 V to 3.6 V; Tamb = −40 °C to +125 °C; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Tlim(acc)

temperature limit accuracy

B grade; VDD = 3.3 V ± 10 %

Tamb =75 °Cto95 °C

−1.0

±0.5

+1.0

°C

Tamb =40 °C to 125 °C

−2.0

±1.0

+2.0

°C

Tamb = −40 °C to +125 °C

−3.0

±2

+3.0

°C

Tres

temperature resolution

0.125

°C

Tconv

conversion period

conversion time from STOP bit

to conversion complete

100

120

Ef(conv)

conversion rate error

percentage error in

programmed data

−30

+30

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