MX877

9

06/08/06

Drawing No. 087709

www.claremicronix.com

MX877

IXYS

IXYS Corporation makes no representations or warranties with respect to the accuracy or completeness of the contents of this

publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither

circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS’ Standard Terms and Conditions of Sale,

IXYS Corporation assumes no liability whatsoever, and disclaims any expressed or implied warranty, relating to its products

including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any

.128

.118

3.25

3.00

E2

NOTES: (UNLESS OTHERWISE SPECIFIED)

HEAT SINK SLUG AS WELL AS THE TERMINALS.

3. MOLDED PACKAGE SHALL CONFORM TO

2. DIMENSIONS AND TOLERANCING CONFORM

1. COPLANARITY APPLIES TO THE EXPOSED

.0197 BSC

.0256

MO-220 VARIATION VHHD-1.

TO ASME Y14.5M-1994.

JEDEC STANDARD CONFIGURATION

.0177

28

L

N

e

.500 BSC

28

.65

.45

BOTTOM VIEW

SIDE VIEW

28 LEAD 5MM X 5MM X 0.90MM QFN

MM.

INCH

.039

.008 REF.

.012

.197 BSC

.128

.197 BSC

.002

MAX.

.031

.007

.118

A2

D2

E

D

b

A1

A

0

DIM.

MIN.

5.00 BSC

3.25

3.00

5.00 BSC

,200 REF.

1.0

.80

.30

.18

.05

0

MAX.

MIN.

DIMENSIONS

TOP VIEW

PIN 1

(REF.)