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LTC3823IGN Datasheet(PDF) 20 Page - Linear Technology |
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LTC3823IGN Datasheet(HTML) 20 Page - Linear Technology |
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20 / 26 page ![]() LTC3823 20 3823fd APPLICATIONS INFORMATION Design Example As a design example, take a supply with the following specifications: VIN = 5V to 28V (15V nominal), VOUT = 2.5V ±5%, IOUT(MAX) = 10A, f = 320kHz. First, calculate the timing resistor with VON = VOUT: R V VkHz pF k ON = ()( )( ) = 25 3 2 5 320 10 104 . . Ω and choose the inductor for about 40% ripple current at the maximum VIN: L V kHz A V V = ()( )( ) − ⎛ ⎝ ⎜ ⎞ ⎠ ⎟ = 25 320 0 4 10 1 25 28 17 . . . .7 7µH Selecting a standard value of 1.2μH results in a maximum ripple current of: Δ μ I V kHz H V V A L = ()( ) ⎛ ⎝ ⎜ ⎞ ⎠ ⎟ = 25 320 1 2 1 25 28 59 . . – . . Next, choose the synchronous MOSFET switch. Choosing a Si7892ADP (RDS(ON) = 0.005Ω (NOM) 0.006Ω (MAX), θJA = 50°C/W) yields a nominal sense voltage of: VSNS(NOM) = (7A)(1.3)(0.005Ω) = 45mV Tying VRNG to0.75Vwillsetthecurrentsensevoltagerange for a nominal value of 75mV with current limit occurring at 100mV. To check if the current limit is acceptable, as- sume a junction temperature of about 80°C above a 70°C ambient with ρ150°C = 1.5: I mV AA LIMIT ≥ ()( ) + () = 100 15 0006 1 2 59 14 .. . Ω and double check the assumed TJ in the MOSFET: P VV V AW BOT = () ( )( ) = 28 25 28 14 15 0 006 16 2 –. .. . Ω TJ = 70°C + (1.6W)(50°C/W) = 150°C Because the top MOSFET is on for such a short time, an Si7342DP RDS(ON)(MAX) = 0.010Ω, CRSS = 120pF, θJA=53°C/Wwillbesufficient.Checkingitspowerdissipa- tion at current limit with ρ100°C=1.4: P V V A V TOP = () ( ) Ω ()+ ()( ) 25 28 14 1 4 0 010 17 28 2 2 . .. .1 14 120 320 025 0 72 097 ApF kHz WW W ()( )( ) =+= .. . TJ = 70°C + (0.97W)(53°C/W) = 121°C The junction temperature will be significantly less at nominal current, but this analysis shows that careful at- tention to heat sinking on the board will be necessary in this circuit. CIN is chosen for an RMS current rating of about 3A at 85°C. The output capacitors are chosen for a low ESR of 0.013Ω to minimize output voltage changes due to inductor ripple current and load steps. The ripple voltage will be only: ΔVOUT(RIPPLE) = ΔIL(MAX) (ESR) = (5.9A) (0.013Ω) = 77mV However, a 0A to 10A load step will cause an output change of up to: ΔVOUT(STEP) = ΔILOAD (ESR) = (10A) (0.013Ω) = 130mV An optional 22μF ceramic output capacitor is included to minimize the effect of ESL in the output ripple. The complete circuit is shown in Figure 12. PC Board Layout Checklist When laying out a PC board follow one of two suggested approaches. The simple PC board layout requires a ded- icated ground plane layer. Also, for higher currents, it is recommended to use a multilayer board to help with heat sinking power components. • The ground plane layer should not have any traces and it should be as close as possible to the layer with power MOSFETs. |
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