Copyright

© ANPEC Electronics Corp.

Rev. A.3 - Jul., 2009

www.anpec.com.tw

3

APA2178

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Resistance in Free Air

(Note 2)

WLCSP2x2-16

160

Symbol

Parameter

Rating

Unit

PVDD to VDD Voltage

-0.3 to 0.3

V

PGND to GND Voltage

-0.3 to 0.3

V

Supply Voltage (VDD and PVDD to GND and PGND)

-0.3 to 5.5

V

Input Voltage (RSD and LSD to GND)

V

VSS and CVSS to GND and PGND Voltage

-5.5 to 0.3

V

ROUT and LOUT to GND Voltage

V

CP+ to PGND Voltage

V

CP- to PGND Voltage

V

Operating Ambient Temperature Range

-40 to 85

Maximum Junction Temperature

150

Storage Temperature Range

-65 to +150

Maximum Soldering Temperature Range, 10 Seconds

260

Power Dissipation

Internally Limited

W

(Over operating free-air temperature range unless otherwise noted.)

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Thermal Characteristics

Symbol

Parameter

Range

Unit

Supply Voltage

1.8 ~ 4.5

V

High Level Threshold Voltage

RSD, LSD

V

Low Level Threshold Voltage

RSD, LSD

V

Common Mode Input Voltage

V

Ambient Temperature

-40 ~ 85

Junction Temperature

-40 ~ 125

Headphone Resistance

14 ~

Ω

Note 3 : Refer to the typical application circuit.

Note 2: Please refer to “Thermal Pad Consideration”. 2 layered 5 in2 printed circuit boards with 2oz trace and copper through several

thermal vias. The thermal pad is soldered on the PCB.