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APL5316 Datasheet(PDF) 2 Page - Anpec Electronics Coropration |
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APL5316 Datasheet(HTML) 2 Page - Anpec Electronics Coropration |
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2 / 15 page ![]() Copyright © ANPEC Electronics Corp. Rev. A.2 - Aug, 2008 APL5316 www.anpec.com.tw 2 Symbol Parameter Rating Unit VIN VIN Supply Voltage (VIN to GND) -0.3 ~ 6.5 V VSHDN SHDN Input Voltage (SHDN to GND) -0.3 ~ 6.5 V PD Power Dissipation Internally Limited W TJ Junction Temperature -40 ~ 150 ° C TSTG Storage Temperature -65 ~ 150 ° C TSDR Maximum Lead Soldering Temperature, 10 Seconds 260 ° C Absolute Maximum Ratings Thermal Characteristics Symbol Parameter Typical Value Unit θ JA Thermal Resistance-Junction to Ambient (Note 1) 240 oC/W θ JC Thermal Resistance- Junction to Case 130 oC/W Note 1 : θ JA is measured with the component mounted on a high effective thermal conductivity test board in free air. Recommended Operating Conditions Symbol Parameter Range Unit VIN VIN Supply Voltage 2.8 ~ 6 V VOUT Output Voltage Fixed Voltage V IOUT VOUT Output Current 0 ~ 300 mA COUT Output Capacitor 1.5 ~ 22 µF TJ Junction Temperature -40 ~ 125 oC Simplified Application Circuits VIN GND VOUT POK C IN 3 2 1 5 4 APL5316 V OUT C OUT V IN POK R 1 SHDN VIN SHDN GND VOUT POK C IN 3 2 1 5 4 APL5316 V OUT C OUT V IN V IN POK R 1 |
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