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STM32F100C6 Datasheet(PDF) 71 Page - STMicroelectronics |
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STM32F100C6 Datasheet(HTML) 71 Page - STMicroelectronics |
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71 / 84 page ![]() STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Electrical characteristics Doc ID 16455 Rev 2 71/84 Figure 35. 12-bit buffered /non-buffered DAC 1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directly without the use of an external operational amplifier. The buffer can be bypassed by configuring the BOFFx bit in the DAC_CR register. 5.3.18 Temperature sensor characteristics Offset(3) Offset error (difference between measured value at Code (0x800) and the ideal value = VREF+/2) ±10 mV Given for the DAC in 12-bit configuration ±3 LSB Given for the DAC in 10-bit at VREF+ = 3.6 V ±12 LSB Given for the DAC in 12-bit at VREF+ = 3.6 V Gain error(3) Gain error ±0.5 % Given for the DAC in 12bit configuration tSETTLING ( 3) Settling time (full scale: for a 10-bit input code transition between the lowest and the highest input codes when DAC_OUT reaches final value ±1LSB 34 µs CLOAD 50 pF, RLOAD 5 k Update rate(3) Max frequency for a correct DAC_OUT change when small variation in the input code (from code i to i+1LSB) 1MS/s CLOAD 50 pF, RLOAD 5 k tWAKEUP (3) Wakeup time from off state (Setting the ENx bit in the DAC Control register) 6.5 10 µs CLOAD 50 pF, RLOAD 5 k input code between lowest and highest possible ones. PSRR+ (1) Power supply rejection ratio (to VDDA) (static DC measurement –67 –40 dB No RLOAD, CLOAD = 50 pF 1. Guaranteed by characterization, not tested in production. 2. Guaranteed by design, not tested in production. 3. Guaranteed by characterization, not tested in production. Table 45. DAC characteristics (continued) Symbol Parameter Min Typ Max(1) Unit Comments R LOAD C LOAD Buffered/Non-buffered DAC DACx_OUT Buffer(1) 12-bit digital to analog converter ai17157 |
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