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MAX11044 Datasheet(PDF) 13 Page - Maxim Integrated Products |
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MAX11044 Datasheet(HTML) 13 Page - Maxim Integrated Products |
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13 / 20 page ![]() External Reference Set the configuration register to disable the internal ref- erence and drive REFIO with a high-quality external ref- erence. To avoid signal degradation, ensure that the integrated reference noise applied to REFIO is less than 10μV in the bandwidth of up to 50kHz. Reference Buffer The MAX11044/MAX11045/MAX11046 have a built-in reference buffer to provide a low-impedance reference source to the SAR converters. This buffer is used in both internal and external reference mode. The refer- ence buffer output feeds five RDC pins. The RDC pins should be all connected together on the PCB. The ref- erence buffer is externally compensated and requires at least 10μF on the RDC node. For best performance, provide a total of at least 80μF on the RDC outputs. Transfer Functions Figures 8 and 9 show the transfer functions for all the formats and devices. Code transitions occur halfway between successive-integer LSB values. Layout, Grounding, and Bypassing For best performance use PCBs with ground planes. Ensure that digital and analog signal lines are separated from each other. Do not run analog and digital lines paral- lel to one another (especially clock lines), and avoid run- ning digital lines underneath the ADC package. A single solid GND plane configuration with digital signals routed from one direction and analog signals from the other pro- vides the best performance. Connect DGND, AGND, and AGNDS pins on the MAX11044/MAX11045/MAX11046 to this ground plane. Keep the ground return to the power supply for this ground low impedance and as short as possible for noise-free operation. To achieve the highest performance, connect all the RDC pins (22, 28, 36, 43, and 49) to a local RDC plane on the PCB. A total of at least 80μF of capacitance should be placed on this RDC plane. If two capacitors are used, place each as close as possible to pins 22 and 49. If four capacitors are used, place each as close as possible to pins 22, 28, 43, and 49. For exam- ple, two 47μF, 10V X5R capacitors in 1210 case size can be placed as close as possible to pins 22 and 49 will provide excellent performance. Alternatively, four 22μF, 10V X5R capacitors in 1210 case size placed as close as possible to pins 22, 28, 43, and 49 will also provide good performance. Ensure that each capacitor is connected directly into the GND plane with an inde- pendent via. If Y5U or Z5U ceramics are used, be aware of the high- voltage coefficient these capacitors exhibit and select higher voltage rating capacitors to ensure that at least 80μF of capacitance is on the RDC plane when the plane is driven to 4.096V by the built-in reference buffer. For example, a 22μF X5R with a 10V rating is approximately 20μF at 4.096V, whereas, the same capacitor in Y5U ceramic is just 13μF. However, a Y5U 22μF capacitor with a 25V rating cap is approximately 20μF at 4.096V. Sn Sn + 1 t8 t12 t13 t9 t10 t11 RD (USER SUPPLIED) CS (USER SUPPLIED) D0–D15 Figure 5. Readout Timing Requirements CONFIGURATION REGISTER t6 t3 t4 t5 t7 WR (USER SUPPLIED) CS (USER SUPPLIED) D0–D15 (USER SUPPLIED) Figure 4. Programming Configuration-Register Timing Requirements 4-/6-/8-Channel, 16-Bit, Simultaneous-Sampling ADCs ______________________________________________________________________________________ 13 |
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