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MAX11044 Datasheet(PDF) 13 Page - Maxim Integrated Products

Part # MAX11044
Description  4-/6-/8-Channel, 16-Bit, Simultaneous-Sampling ADCs
PDF  20 Pages
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX11044 Datasheet(HTML) 13 Page - Maxim Integrated Products

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External Reference
Set the configuration register to disable the internal ref-
erence and drive REFIO with a high-quality external ref-
erence. To avoid signal degradation, ensure that the
integrated reference noise applied to REFIO is less
than 10μV in the bandwidth of up to 50kHz.
Reference Buffer
The MAX11044/MAX11045/MAX11046 have a built-in
reference buffer to provide a low-impedance reference
source to the SAR converters. This buffer is used in
both internal and external reference mode. The refer-
ence buffer output feeds five RDC pins. The RDC pins
should be all connected together on the PCB. The ref-
erence buffer is externally compensated and requires
at least 10μF on the RDC node. For best performance,
provide a total of at least 80μF on the RDC outputs.
Transfer Functions
Figures 8 and 9 show the transfer functions for all the
formats and devices. Code transitions occur halfway
between successive-integer LSB values.
Layout, Grounding, and Bypassing
For best performance use PCBs with ground planes.
Ensure that digital and analog signal lines are separated
from each other. Do not run analog and digital lines paral-
lel to one another (especially clock lines), and avoid run-
ning digital lines underneath the ADC package. A single
solid GND plane configuration with digital signals routed
from one direction and analog signals from the other pro-
vides the best performance. Connect DGND, AGND, and
AGNDS pins on the MAX11044/MAX11045/MAX11046 to
this ground plane. Keep the ground return to the power
supply for this ground low impedance and as short as
possible for noise-free operation.
To achieve the highest performance, connect all the
RDC pins (22, 28, 36, 43, and 49) to a local RDC plane
on the PCB. A total of at least 80μF of capacitance
should be placed on this RDC plane. If two capacitors
are used, place each as close as possible to pins 22
and 49. If four capacitors are used, place each as
close as possible to pins 22, 28, 43, and 49. For exam-
ple, two 47μF, 10V X5R capacitors in 1210 case size
can be placed as close as possible to pins 22 and 49
will provide excellent performance. Alternatively, four
22μF, 10V X5R capacitors in 1210 case size placed as
close as possible to pins 22, 28, 43, and 49 will also
provide good performance. Ensure that each capacitor
is connected directly into the GND plane with an inde-
pendent via.
If Y5U or Z5U ceramics are used, be aware of the high-
voltage coefficient these capacitors exhibit and select
higher voltage rating capacitors to ensure that at least
80μF of capacitance is on the RDC plane when the
plane is driven to 4.096V by the built-in reference
buffer. For example, a 22μF X5R with a 10V rating is
approximately 20μF at 4.096V, whereas, the same
capacitor in Y5U ceramic is just 13μF. However, a Y5U
22μF capacitor with a 25V rating cap is approximately
20μF at 4.096V.
Sn
Sn + 1
t8
t12
t13
t9
t10
t11
RD
(USER SUPPLIED)
CS
(USER SUPPLIED)
D0–D15
Figure 5. Readout Timing Requirements
CONFIGURATION
REGISTER
t6
t3
t4
t5
t7
WR
(USER SUPPLIED)
CS
(USER SUPPLIED)
D0–D15
(USER SUPPLIED)
Figure 4. Programming Configuration-Register Timing
Requirements
4-/6-/8-Channel, 16-Bit,
Simultaneous-Sampling ADCs
______________________________________________________________________________________
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