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MCS0402AT Datasheet(PDF) 10 Page - Vishay Siliconix

Part # MCS0402AT
Description  Professional Thin Film Chip Resistor Superior Moisture Resistivity
PDF  11 Pages
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

MCS0402AT Datasheet(HTML) 10 Page - Vishay Siliconix

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MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Professional
Professional Thin Film Chip Resistor
Superior Moisture Resistivity
Vishay Beyschlag
Document Number: 28760
For technical questions, contact: thinfilmchip@vishay.com
www.vishay.com
Revision: 07-Dec-09
10
4.27
-
Single pulse high
voltage overload;
standard operation mode
Severity no. 4:
U = 10 x
≤ 2 x Umax.;
10 pulses
± (0.25 %
R +0.05
Ω)
Single pulse high
voltage overload;
power operation mode
± (0.5 %
R +0.05
Ω)
4.37
-
Periodic electric overload;
standard operation mode
U =
≤ 2 x Umax.;
0.1 s on; 2.5 s off;
1000 cycles
± (0.5 %
R +0.05
Ω)
Periodic electric overload;
power operation mode
± (1.0 %
R +0.05
Ω)
4.40
-
ESD
(Electro Static Discharge)
IEC 61340-3-1;
3 pos. + 3 neg.
(equivalent to MIL-STD-883,
Method 3015)
MCS 0402 AT: 500 V
MCT 0603 AT: 1000 V
MCU 0805 AT: 1500 V
MCA 1206 AT: 2000 V
± (0.5 %
R +0.05
Ω)
4.22
6 (Fc)
Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude
≤ 1.5 mm or
≤ 200 m/s2; 6 h
± (0.1 %
R +0.01
Ω)
no visible damage
4.17.2
58 (Td)
Solderability
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Good tinning (
≥ 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning (
≥ 95 % covered);
no visible damage
4.18.2
58 (Td)
Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
± (0.1 %
R +0.01
Ω)
no visible damage
4.29
45 (XA)
Component solvent
resistance
Isopropyl alcohol + 50
°C;
method 2
No visible damage
4.32
21 (Ue3)
Shear (adhesion)
RR 1005M and
RR 1608M; 9 N
No visible damage
RR 2012M and
RR 3216M; 45 N
4.33
21 (Ue1)
Substrate bending
Depth 2 mm, 3 times
± (0.1 %
R +0.01
Ω)
no visible damage; no open circuit in bent position
4.7
-
Voltage proof
URMS = Uins; (60 ± 5) s
No flashover or breakdown
4.35
-
Flammability
Needle flame test; 10 s
No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (
ΔR)
STABILITY CLASS 0.5 OR BETTER
Stability for product types:
MCS 0402 AT
47
Ω to 47 kΩ
MCT 0603 AT
47
Ω to 100 kΩ
MCU 0805 AT
47
Ω to 100 kΩ
MCA 1206 AT
47
Ω to 100 kΩ
P
70 x R
15 x
P
70 x R



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