PCA9549_2

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 02 — 13 July 2009

4 of 25

NXP Semiconductors

PCA9549

5.2 Pin description

[1]

and board-level performance, the exposed pad needs to be soldered to the board using a corresponding

thermal pad on the board, and for proper heat conduction through the board thermal vias need to be

incorporated in the PCB in the thermal pad region.

Table 3.

Pin description

Symbol

Pin

Description

SO24, TSSOP24

HVQFN24

A0

1

22

address input 0

A1

2

23

address input 1

RESET

3

24

active LOW reset input

1A

4

1

input

1B

5

2

output

2A

6

3

input

2B

7

4

output

3A

8

5

input

3B

9

6

output

4A

10

7

input

4B

11

8

output

12

9[1]

supply ground

5B

13

10

output

5A

14

11

input

6B

15

12

output

6A

16

13

input

7B

17

14

output

7A

18

15

input

8B

19

16

output

8A

20

17

input

A2

21

18

address input 2

SCL

22

19

serial clock line

SDA

23

20

serial data line

24

21

supply voltage