PCA9554DB datasheet(24/30 Pages) NXP

24 / 30 page

PCA9554_9554A_7

Product data sheet

Rev. 07 — 13 November 2006

24 of 30

NXP Semiconductors

PCA9554/PCA9554A

8-bit I2C-bus and SMBus I/O port with interrupt

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classiﬁed in accordance with

Table 11 and 12

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reﬂow

soldering, see Figure 25.

For further information on temperature proﬁles, refer to Application Note

AN10365

“Surface mount reﬂow soldering description”.

Table 11.

SnPb eutectic process (from J-STD-020C)

Package thickness (mm)

Package reﬂow temperature (

°C)

Volume (mm3)

< 350

≥ 350

< 2.5

235

220

≥ 2.5

220

Table 12.

Lead-free process (from J-STD-020C)

Package thickness (mm)

Package reﬂow temperature (

°C)

Volume (mm3)

< 350

350 to 2000

> 2000

< 1.6

260

1.6 to 2.5

260

250

245

> 2.5

250

245

MSL: Moisture Sensitivity Level

Fig 25. Temperature proﬁles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

PCA9554DB Datasheet(PDF) 24 Page - NXP Semiconductors

PCA9554DB Datasheet(HTML) 24 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

Datasheet Download

Link URL