MAX9867 datasheet(2/55 Pages) MAXIM

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Ultra-Low Power Stereo Audio Codec

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ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VAVDD = VPVDD = VDVDD = VDVDDIO = +1.8V, RL = ∞, headphone load (RL) connected between _OUTP and _OUTN in differential

mode, CREF = 2.2µF, CMICBIAS = CPREG = CREG = 1µF, AVPRE = +20dB, AVPGAM = 0dB, AVDAC = 0dB, AVLINE = +20dB, AVVOL =

0dB, MCLK = 13MHz, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

(Voltages with respect to AGND.)

DVDD, AVDD, and PVDD .........................................-0.3V to +2V

DVDDIO.................................................................-0.3V to +3.6V

DGND and PGND..................................................-0.1V to +0.1V

PREG, REF, REG, MICBIAS ....................-0.3V to (AVDD + 0.3V)

MCLK, LRCLK, BCLK

SDOUT, SDIN .................................-0.3V to (DVDDIO + 0.3V)

SDA, SCL, IRQ ......................................................-0.3V to +3.6V

LOUTP, LOUTN, ROUTP,

ROUTN .................................(PGND - 0.3V) to (PVDD + 0.3V)

LINL, LINR, JACKSNS/AUX, MICLP/DIGMICDATA,

MICLN/DIGMICCLK, MICRP, MICRN..-0.3V to (AVDD + 0.3V)

Continuous Power Dissipation (TA = +70°C)

30-Bump WLP (derate 12.5mW/°C above +70°C) ....1000mW

32-Pin TQFN-EP (derate 34.5mW/°C above +70°C) .2759mW

Junction-to-Ambient Thermal Resistance (

θJA) (Note 1)

30-Bump WLP .............................................................80°C/W

32-Pin TQFN-EP ..........................................................29°C/W

Operating Temp Range .......................................-40°C to +85°C

Storage Temp Range ........................................-65°C to +150°C

Lead Temperature (TQFN only, 10s) ...............................+300°C

Soldering Temperature (reflow) .......................................+260°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

PVDD, DVDD, AVDD

1.65

1.8

1.95

Supply Voltage Range

DVDDIO

1.65

1.8

3.6

Analog (AVDD +

PVDD)

4.65

Full-duplex 8kHz

mono (voice mode)

(Note 3)

Digital (DVDD +

DVDDIO)

0.96

1.5

Analog (AVDD +

PVDD)

3.28

DAC playback 48kHz

stereo (audio mode)

(Note 3)

Digital (DVDD +

DVDDIO)

1.40

Analog (AVDD +

PVDD)

8.0

Full-duplex 48kHz

stereo (audio mode)

(Note 3)

Digital (DVDD +

DVDDIO)

2.0

Analog (AVDD +

PVDD)

3.8

Total Supply Current

IVDD

Stereo line-in only

Digital (DVDD +

DVDDIO)

0.004

0.05

Analog (AVDD +

PVDD)

Shutdown Supply Current

TA = +25°C

Digital (DVDD +

DVDDIO)

µA

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

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