| Electronic Components Datasheet Search |
|
EMP216 Datasheet(PDF) 5 Page - Excelics Semiconductor, Inc. |
|
|
|||||||||||||||||||||||||||||
EMP216 Datasheet(HTML) 5 Page - Excelics Semiconductor, Inc. |
|
5 / 5 page ![]() EMP216 6 - 18 GHz 2 Watt Power Amplifier MMIC Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Page 5 of 5 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Revision 03 Application Hints Biasing The EMP216 requires a negative bias voltage applied to VGG and positive bias voltage applied to VDD. Power supplies must be sequenced to apply VGG first, then VDD. When removing power, VDD must be turned off first, then VGG. VGG will draw very little current under small signal RF conditions, but as output power approaches the 1dB compression point, the VGG input will draw current up to several milliamps. The VGG supply must be capable of both sinking and sourcing this current. Assembly Recommended method of die attachment is AuSn eutectic. Wire bonding should be thermocompression bonding with no ultrasonics. To obtain full performance, RF input and output bond wires should be as short as possible. Wire length should be 7 mils maximum, with at least two wires per pad. Mounting the EMP216 on a “ridge” or pedestal is recommended to align the top surface of the MMIC to the interfacing substrate and minimize bond wire length. ESD warning The EMP216 is susceptible to damage from ESD and should only be handled in an ESD safe work station environment. Military and Hi-Rel screening Contact factory for military and hi-rel grades. DISCLAIMER EXCELICS SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. EXCELICS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN. LIFE SUPPORT POLICY EXCELICS SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF EXCELICS SEMICONDUCTOR, INC. AS HERE IN: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |