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M34E02-FDW6TP Datasheet(PDF) 9 Page - STMicroelectronics

Part # M34E02-FDW6TP
Description  2 Kbit serial presence detect (SPD) EEPROM for double data rate (DDR1 and DDR2) DRAM modules
PDF  34 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M34E02-FDW6TP Datasheet(HTML) 9 Page - STMicroelectronics

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M34E02, M34E02-F
Signal description
Doc ID 10367 Rev 10
9/34
2.5
Supply voltage (VCC)
2.5.1
Operating supply voltage VCC
Prior to selecting the memory and issuing instructions to it, a valid and stable VCC voltage
within the specified [VCC(min), VCC(max)] range must be applied (see Table 8). In order to
secure a stable DC supply voltage, it is recommended to decouple the VCC line with a
suitable capacitor (usually of the order of 10 nF to 100 nF) close to the VCC/VSS package
pins.
This voltage must remain stable and valid until the end of the transmission of the instruction
and, for a Write instruction, until the completion of the internal write cycle (tW).
2.5.2
Power-up conditions
The VCC voltage has to rise continuously from 0 V up to the minimum VCC operating voltage
defined in Table 8 and the rise time must not vary faster than 1 V/µs.
2.5.3
Device reset
In order to prevent inadvertent write operations during power-up, a power-on reset (POR)
circuit is included. At power-up, the device does not respond to any instruction until VCC
reaches the internal reset threshold voltage (this threshold is lower than the minimum VCC
operating voltage defined in Table 8).
When VCC passes over the POR threshold, the device is reset and enters the Standby
Power mode. However, the device must not be accessed until VCC reaches a valid and
stable VCC voltage within the specified [VCC(min), VCC(max)] range.
In a similar way, during power-down (continuous decrease in VCC), as soon as VCC drops
below the power-on reset threshold voltage, the device stops responding to any instruction
sent to it.
2.5.4
Power-down conditions
During power-down (continuous decrease in VCC), the device must be in Standby Power
mode (mode reached after decoding a Stop condition, assuming that there is no internal
write cycle in progress).
Figure 4.
Maximum RP value versus bus parasitic capacitance (C) for an I
2C bus
1
10
100
10
100
1000
Bus line capacitor (pF)
When tLOW = 1.3 µs (min value for
fC = 400 kHz), the Rbus × Cbus
time constant must be below the
400 ns time constant line
represented on the left.
I²C bus
master
M24xxx
Rbus
VCC
Cbus
SCL
SDA
ai14796b
R
bus
×
C
bus
= 400
ns
Here Rbus × Cbus = 120 ns
4 k
Ω
30 pF



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