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ISO3080 Datasheet(PDF) 10 Page - Texas Instruments

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Part # ISO3080
Description  ISOLATED 5-V FULL AND HALF-DUPLEX RS-485 TRANSCEIVERS
PDF  19 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

ISO3080 Datasheet(HTML) 10 Page - Texas Instruments

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ISO3080, ISO3086
ISO3082, ISO3088
SLOS581C – MAY 2008 – REVISED OCTOBER 2009
www.ti.com
REGULATORY INFORMATION
VDE
CSA
UL
Approved under CSA Component
Recognized under 1577 Component
Certified according to IEC 60747-5-2
Acceptance Notice
Recognition Program(1)
File Number: 40016131
File Number: 1698195
File Number: E181974
(1)
Production tested
≥3000 VRMS for 1 second in accordance with UL 1577.
IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.
A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate
sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system
failures.
PARAMETER
MIN
TYP
MAX
UNIT
Safety input, output, or supply
θJA = 212°C/W, VI = 5.5 V, TJ = 170°C,
IS
DW-16
210
mA
current
TA = 25°C
TS
Maximum case temperature
DW-16
150
°C
The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum
ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the
Thermal Characteristics table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity
Test Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum
input voltage times the current. The junction temperature is then the ambient temperature plus the power times
the junction-to-air thermal resistance.
THERMAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Low-K Thermal Resistance(1)
168
θJA
Junction-to-Air
°C/W
High-K Thermal Resistance
96.1
θJB
Junction-to-Board Thermal Resistance
61
°C/W
θJC
Junction-to-Case Thermal Resistance
48
°C/W
VCC1 = VCC2 = 5.25 V, TJ = 150°C, CL = 15 pF,
PD
Device Power Dissipation
220
mW
Input a 20 MHz 50% duty cycle square wave
(1)
Tested in accordance with the Low-K or High-K thermal metric defintions of EIA/JESD51-3 for leaded surface mount packages.
10
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Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088



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