7-39
7
Preliminary
Product Description
Ordering Information
Typical Applications
Features
Functional Block Diagram
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Optimum Technology Matching® Applied
Si BJT
GaAs MESFET
GaAs HBT
Si Bi-CMOS
ü
SiGe HBT
Si CMOS
7
Gain
Control
Div
4
I/Q
Cal
Mode Control
&Biasing
8
4
W-CDMA IN+
2
NC
6
20
1
17
14 I OUT+
15 ENCAL
16 FCLK
11 Q OUT-
19 VREF2V
10
3
NC
5
W-CDMA IN-
9
12 Q OUT+
13 I OUT-
18
RF2690
W-CDMA RECEIVE AGC
AND DEMODULATOR
• W-CDMA Systems
The RF2690 is an integrated complete IF AGC amplifier
and quadrature demodulator designed for the receive
section of W-CDMA applications. It is designed to amplify
received IF signals, while providing 70 dB of gain control
range, a total of 90dB gain, and demodulation to base-
band I and Q signals. This circuit is designed as part of
RFMD’s single mode W-CDMA chipset, which includes
the RF9678 as modulator and IF AGC and the RF2638 as
upconvertor. The IC is manufactured on an advanced
25GHz FT Silicon Bi-CMOS process, and is packaged in
a 20-pin, 4mmx4mm, leadless chip carrier.
• Digitally Controlled Power Down Mode
• 2.7V to 3.3V Operation
• Digital LO Quadrature Divide-by-4
• IF AGC Ampwith70dBGainControl
• 80dB Maximum Voltage Gain
RF2690
W-CDMA Receive AGC and Demodulator
RF2690 PCBA
Fully Assembled Evaluation Board
7
Rev A4 010918
1.00
0.90
4.00
sq.
0.60
0.24 typ
3
0.20
0.75
0.50
0.23
0.13
4PLCS
0.50
2.10
sq.
0.65
0.30
4PLCS
0.05
12°
MAX
Dimensions in mm.
Note orientation of package.
NOTES:
Package Warpage: 0.05 mm max.
4
Die Thickness Allowable: 0.305 mm max.
5
Pin 1 identifier must exist on top surface of package by identification
mark or feature on the package body. Exact shape and size is optional.
2
Shaded lead is Pin 1.
1
Dimension applies to plated terminal: to be measured between 0.02 mm
and 0.25 mm from terminal end.
3
Package Style: LCC, 20-Pin, 4x4
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