9000 datasheet(65/108 Pages) INTEL

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Dual-Core Intel® Itanium® Processor 9000 and 9100 Series Datasheet

Mechanical Specifications

This chapter provides the mechanical specifications of the Dual-Core Intel Itanium

processor 9000 and 9100 series.

4.1

Processor Package Dimensions

Figure 4-1 through Figure 4-5 provide package mechanical drawings and dimensions of

the processor. Table 4-1 and Table 4-2 provide additional details on the package

dimensions. The main components of processor package are identified in Figure 4-2. All

specified package dimensions are in millimeters.

Figure 4-1 illustrates key package mechanical features. These features enable package

integration with socket, power pod, and cooling solution.

• Vcore, Vcache, Vfixed, GND, and VID Pads: Contact pads for delivering power

and I/O signals from the voltage regulator to the processor through its substrate.

• Socket Alignment Keyways: They define package position in X and Y direction

with respect to socket for proper alignment of package pins to socket contact holes.

• Pin Shroud Alignment Keyways: They define pin shroud position in X and Y

direction with respect to processor.

• Pin 1 Indicators: Identifies package orientation with respect to socket and

motherboard.

• Integrated Heat Spreader (IHS): Enhances dissipation of heat generated by the

processor. Provides interface surface between processor and cooling solution.

• Substrate: Processor mechanical and electrical integration vehicle with the

motherboard and processor enabling components.

• Pin Field (Grid): 28 x 25 partially-filled pin field for transmitting signals to and

from processor to motherboard.

• Voltage Regulator Connector Back Plate Keyway: It defines the VR connector

back plate position in X and Y direction with respect to the processor.

9000 Datasheet(PDF) 65 Page - Intel Corporation