360J datasheet(32/68 Pages) INTEL

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Package Mechanical Specifications and Pin Information

Datasheet

NOTES:

Overall height with socket is based on design dimensions of the Micro-FCPGA package with

no thermal solution attached. Values are based on design specifications and tolerances.

This dimension is subject to change based on socket design, OEM motherboard design or

OEM SMT process.

Table 12.

Micro-FCPGA Package Dimensions

Symbol

Parameter

Min

Max

Unit

Overall height, top of the die to package seating plane

1.88

2.02

–

Overall height, top of die to PCB surface, including

socket (Refer to Note 1)

4.74

5.16

Pin length

1.95

2.11

Die height

0.820

Pin-side capacitor height

–

1.25

Pin diameter

0.28

0.36

Package substrate length

34.9

35.1

Package substrate width

34.9

35.1

Die length

12.54

Die width

6.99

ePin pitch

1.27

Package edge keep-out

Package corner keep-out

Pin-side capacitor boundary

Pin count

478

each

Pdie

Allowable pressure on the die for thermal solution

689

kPa

WPackage weight

4.5

Package surface flatness

0.286

360J Datasheet(PDF) 32 Page - Intel Corporation

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