353 datasheet(3/68 Pages) INTEL

3 / 68 page

Datasheet

Contents

1Introduction ..............................................................................................................7

1.1

Terminology .......................................................................................................8

1.2

References .........................................................................................................8

Low Power Features ................................................................................................ 11

2.1

Clock Control and Low Power States .................................................................... 11

2.1.1

Normal State ......................................................................................... 11

2.1.2

AutoHALT Power-Down State ................................................................... 11

2.1.3

Stop-Grant State.................................................................................... 11

2.1.4

HALT/Grant Snoop State ......................................................................... 12

2.1.5

Sleep State ........................................................................................... 12

2.1.6

Deep Sleep State ................................................................................... 13

2.2

FSB Low Power Enhancements ............................................................................ 13

2.3

Processor Power Status Indicator (PSI#) Signal..................................................... 14

Electrical Specifications ........................................................................................... 15

3.1

Power and Ground Pins ...................................................................................... 15

3.1.1

FSB Clock (BCLK[1:0]) and Processor Clocking........................................... 15

3.2

Voltage Identification and Power Sequencing ........................................................ 15

3.3

Catastrophic Thermal Protection .......................................................................... 17

3.4

Signal Terminations and Unused Pins ................................................................... 17

3.5

FSB Frequency Select Signals (BSEL[1:0])............................................................ 17

3.6

FSB Signal Groups............................................................................................. 17

3.7

CMOS Signals ................................................................................................... 19

3.8

Maximum Ratings.............................................................................................. 19

3.9

Processor DC Specifications ................................................................................ 19

Package Mechanical Specifications and Pin Information .......................................... 29

4.1

Processor Pinout and Pin List .............................................................................. 37

4.2

Alphabetical Signals Reference ............................................................................ 55

Thermal Specifications and Design Considerations .................................................. 63

5.1

Thermal Specifications ....................................................................................... 65

5.1.1

Thermal Diode ....................................................................................... 65

5.1.2

Thermal Diode Offset .............................................................................. 66

5.1.3

Intel® Thermal Monitor........................................................................... 67

353 Datasheet(PDF) 3 Page - Intel Corporation

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