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L7700 Datasheet(PDF) 3 Page - Intel Corporation

Part # L7700
Description  Core2 Duo Processors and Core2 Extreme Processors for Platforms Based on Mobile 965 Express Chipset Family
PDF  87 Pages
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

L7700 Datasheet(HTML) 3 Page - Intel Corporation

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Datasheet
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Contents
1Introduction ..............................................................................................................7
1.1
Terminology .......................................................................................................8
1.2
References .........................................................................................................9
2
Low Power Features ................................................................................................ 11
2.1
Clock Control and Low Power States .................................................................... 11
2.1.1
Core Low Power State Descriptions ........................................................... 13
2.1.2
Package Low Power State Descriptions ...................................................... 15
2.2
Enhanced Intel SpeedStep® Technology .............................................................. 18
2.2.1
Dynamic FSB Frequency Switching ........................................................... 19
2.2.2
Intel® Dynamic Acceleration Technology................................................... 19
2.3
Extended Low Power States ................................................................................ 19
2.4
FSB Low Power Enhancements ............................................................................ 20
2.5
VID-x .............................................................................................................. 21
2.6
Processor Power Status Indicator (PSI-2) Signal .................................................... 21
3
Electrical Specifications ........................................................................................... 23
3.1
Power and Ground Pins ...................................................................................... 23
3.2
FSB Clock (BCLK[1:0]) and Processor Clocking...................................................... 23
3.3
Voltage Identification ......................................................................................... 23
3.4
Catastrophic Thermal Protection .......................................................................... 26
3.5
Reserved and Unused Pins.................................................................................. 26
3.6
FSB Frequency Select Signals (BSEL[2:0])............................................................ 27
3.7
FSB Signal Groups............................................................................................. 27
3.8
CMOS Signals ................................................................................................... 29
3.9
Maximum Ratings.............................................................................................. 29
3.10 Processor DC Specifications ................................................................................ 30
4
Package Mechanical Specifications and Pin Information .......................................... 41
4.1
Package Mechanical Specifications ....................................................................... 41
4.2
Processor Pinout and Pin List .............................................................................. 49
4.3
Alphabetical Signals Reference ............................................................................ 69
5
Thermal Specifications and Design Considerations .................................................. 77
5.1
Thermal Specifications ....................................................................................... 80
5.1.1
Thermal Diode ....................................................................................... 81
5.1.2
Thermal Diode Offset .............................................................................. 83
5.1.3
Intel® Thermal Monitor........................................................................... 84
5.1.4
Digital Thermal Sensor............................................................................ 86
5.1.5
Out of Specification Detection .................................................................. 87
5.1.6
PROCHOT# Signal Pin ............................................................................. 87



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