BSP299 datasheet(2/10 Pages) INFINEON

2 / 10 page

Rev 2.1

2009-03-25

BSP 299

Maximum Ratings

Parameter

Symbol

Values

Unit

Chip or operating temperature

-55 ... + 150

°C

Storage temperature

Tstg

-55 ... + 150

Thermal resistance, chip to ambient air

R thJA

≤ 70

K/W

Therminal resistance, junction-soldering point

RthJS

≤ 25

DIN humidity category, DIN 40 040

IEC climatic category, DIN IEC 68-1

55 / 150 / 56

1) Transistor on epoxy pcb 40 mm x 40 mm x 1,5 mm with 6 cm2 copper area for drain connection

Electrical Characteristics,

at Tj = 25°C, unless otherwise specified

Parameter

Symbol

Values

Unit

min.

typ.

max.

Static Characteristics

Drain- source breakdown voltage

VGS = 0 V, ID = 0.25 mA, Tj = 0 °C

V(BR)DSS

500

Gate threshold voltage

VGS=VDS, ID = 1 mA

VGS(th)

2.1

Zero gate voltage drain current

VDS = 500 V, VGS = 0 V, Tj = 25 °C

VDS = 500 V, VGS = 0 V, Tj = 125 °C

IDSS

0.1

100

µA

Gate-source leakage current

VGS = 20 V, VDS = 0 V

IGSS

100

Drain-Source on-state resistance

VGS = 10 V, ID = 0.4 A

RDS(on)

3.1

Ω

BSP299 Datasheet(PDF) 2 Page - Infineon Technologies AG

BSP299 Datasheet(HTML) 2 Page - Infineon Technologies AG

Html Pages

1 2 3 4 5 6 7 8 9 10

Datasheet Download

Link URL