TLE7237GS

Electrical Characteristics

Data Sheet

12

Rev. 1.0, 2008-10-30

1) Not subject to production test

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Typ.

Max.

4.3.1

Junction to Case, bottom

R

thJC,back

––

25

K/W

2)

2) Specified

R

T

4.3.2

Junction to Case, top

R

thJC,top

––

25

K/W

2)

4.3.3

Junction to Pin (1,2,11 or 12)

R

thJPin

––

17

K/W

2)

4.3.4

Junction to Ambient

(1s0p, min. footprint)

R

thJA,min

–90

–

K/W

3)

3) Specified

R

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with minimal footprint copper area and 70

µm thickness.

T

4.3.5

Junction to Ambient

R

thJA,300

–

70

–

K/W

4)

4) Specified

R

and 70

4.3.6

Junction to Ambient

R

thJA,600

–

65

–

K/W

5)

5) Specified

R

and 70

4.3.7

Junction to Ambient (2s2p)

R

thJA,2s2p

–

55

–

K/W

6)

6) Specified

R

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70

µm Cu, 2 x 35 µm Cu).

T