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AP7332 Datasheet(PDF) 5 Page - Diodes Incorporated

Part # AP7332
Description  DUAL 300mA LOW QUIESCENT CURRENT FAST TRANSIENT LOW DROPOUT
PDF  18 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

AP7332 Datasheet(HTML) 5 Page - Diodes Incorporated

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AP7332
DUAL 300mA LOW QUIESCENT CURRENT FAST
TRANSIENT LOW DROPOUT LINEAR REGULATOR
AP7332
Document number: DS35132 Rev. 1 - 2
5 of 18
www.diodes.com
December 2010
© Diodes Incorporated
Electrical Characteristics
(TA = 25
oC, V
IN = VOUT +1V, CIN = 1uF, COUT = 1uF, VEN = VIN , unless otherwise stated)
Symbol
Parameter
Test Conditions
Min
Typ.
Max
Unit
VREF
ADJ Reference Voltage
(Adjustable version)
IOUT= 0mA
0.8
V
IADJ
ADJ Leakage (Adjustable version)
0.1
1
μA
VOUT
Output Voltage Accuracy
TA = -40
oC to 85oC,
IOUT = 10% of IOUT-Max
-2
2
%
ΔV
OUT /ΔVIN/V Line Regulation
VIN = (VOUT +1V) to VIN-Max,
VEN = VIN, IOUT = 1mA
0.01
0.20
%/V
ΔV
OUT /VOUT
Load Regulation
VIN = (VOUT +1V) to VIN-Max,
IOUT = 1mA to 300mA
-0.6
0.6
%
VDropout
Dropout Voltage (Note 4)
VOUT < 2.5V, IOUT = 300mA
350
600
mV
VOUT ≥ 2.5V, IOUT = 300mA
250
400
IQ
Input Quiescent Current (2 channels)
VEN = VIN, IOUT = 0mA
60
80
μA
ISHDN
Input Shutdown Current
VEN = 0V, IOUT = 0mA
0.1
1
μA
ILEAK
Input Leakage Current
VEN = 0V, OUT grounded
0.1
1
μA
tST
Start-up Time
VEN = 0V to 2.0V in 1μs,
IOUT = 300mA
150
μs
PSRR
PSRR (Note 5)
VIN = [VOUT +1V]VDC + 0.5VppAC, f =
1kHz, IOUT = 50mA
60
65
dB
ISHORT
Short-circuit Current
VIN = VIN-Min to VIN-Max,
VOUT = 1/4 target VOUT
120
mA
ILIMIT
Current limit
VIN = VIN-Min to VIN-Max,
VOUT/ROUT = 1A
400
600
mA
VIL
EN Input Logic Low Voltage
VIN = VIN-Min to VIN-Max
0.4
V
VIH
EN Input Logic High Voltage
VIN = VIN-Min to VIN-Max
1.4
V
IEN
EN Input Current
VIN = 0V or VIN-Max
-1
1
μA
TSHDN
Thermal shutdown threshold
165
°C
THYS
Thermal shutdown hysteresis
30
°C
θJA
Thermal Resistance Junction-to-Ambient
SOT26 (Note 6)
140
oC/W
DFN2018-6 (Note 7)
60
Notes:
4. Dropout voltage is the voltage difference between the input and the output at which the output voltage drops 2% below its nominal value.
5. This specification is guaranteed by design.
6. Test condition for SOT26: Device mounted on FR-4 substrate PC board, with minimum recommended pad layout
7. Test condition for DFN2018-6: Device mounted on FR-4 2-layer board,2oz copper, with minimum recommended pad on top layer and 3 vias to
bottom layer.



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