 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
LC5824 Datasheet(PDF) 4 Page - Sanyo Semicon Device |
|
|
|||||||||||||||||||||||||||||
LC5824 Datasheet(HTML) 4 Page - Sanyo Semicon Device |
|
|
4 / 24 page  No. 5944-4/24 LC5824, LC5823, LC5822 Pad Arrangement Chip size: 4.92 mm × 5.15 mm Pad size: 120 µm × 120 µm Chip thickness 480 µm (chip specifications) Pad Coordinates PAD No. Pin Coordinates X µm Y µm 60 Seg 22 –2030 –2178 61 Seg 23 –1850 –2178 62 Seg 24 –1670 –2178 63 Seg 25 –1490 –2178 64 Seg 26 –1310 –2178 65 Seg 27 –1130 –2178 66 Seg 28 –950 –2178 67 Seg 29 –770 –2178 68 Seg 30 –590 –2178 69 Seg 31 –410 –2178 70 Seg 32 –230 –2178 71 Seg 33 –50 –2178 72 Seg 34 122 –2178 73 Seg 35 302 –2178 74 Seg 36 482 –2178 75 Seg 37 662 –2178 76 Seg 38 842 –2178 77 Seg 39 1022 –2178 78 Seg 40 1202 –2178 79 Seg 41 1382 –2178 80 Seg 42 1562 –2178 81 XC 1774 –2178 82 XTOUT 1954 –2178 83 XTIN 2134 –2178 1 VDD 2257 –1959 2 VSS 2257 –1779 3 CFIN/P1 2257 –1599 4 CFOUT/P2 2257 –1402 PAD No. Pin Coordinates X µm Y µm 5 VDD3 2257 –1212 6 VDD2/BAK 2257 –1032 7 VDD1 2257 –852 8 ALM 2257 –601 9 SO1 2257 –419 10 SO2 I/O port 2257 –236 11 SO3 I/O port 2257 56 12 SO4 I/O port 2257 132 13 M1 2257 364 14 M2 I/O port 2257 544 15 M3 I/O port 2257 724 16 M4 I/O port 2257 904 17 RES I/O port 2257 1636 18 Test 2330 1998 19 Test 2330 2178 20 TST 2150 2178 21 CUP1 1970 2178 22 CUP2 1790 2178 23 Seg 1 1606 2178 24 Seg 2 1426 2178 25 Seg 3 1246 2178 26 Seg 4 1066 2178 27 Seg 5 886 2178 28 Seg 6 706 2178 29 Seg 7 526 2178 30 Seg 8 346 2178 31 Seg 9 166 2178 32 Seg 10 –14 2178 PAD No. Pin Coordinates X µm Y µm 33 Seg 11 –194 2178 34 Seg 12 –374 2178 35 Seg 13 –546 2178 36 Seg 14 –726 2178 37 Seg 15 –906 2178 38 Seg 16 –1086 2178 39 Seg 17 –1266 2178 40 Seg 18 –1446 2178 41 Seg 19 –1626 2178 42 Seg 20 –1806 2178 43 Seg 21 –1986 2178 44 COM1 –2270 1871 45 COM2 –2270 1628 46 S1 –2270 1367 47 S2 Input port –2270 1140 48 S3 Input port –2270 960 49 S4 Input port –2270 734 50 K1 –2270 328 51 K2 Input port –2270 88 52 K3 Input port –2270 –140 53 K4 Input port –2270 –380 54 A1 –2270 –593 55 A2 I/O ports –2270 –773 56 A3 I/O ports –2270 –953 57 A4 I/O ports –2270 –1133 58 COM3/P3 –2270 –1602 59 COM4/P4 –2270 –1846 Note: • The pin numbers are the QIP-80E mass-production package pin numbers. • The test pin (TST) must be connected to VSS. • Pads number 42 and 43 in the chip version must be left open. • Do not use solder dip techniques to mount the QIP-80E package version. • In the chip version, the substrate must be either connected to VSS or left open. |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
