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MIC2199BML Datasheet(PDF) 13 Page - Micrel Semiconductor |
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MIC2199BML Datasheet(HTML) 13 Page - Micrel Semiconductor |
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13 / 14 page ![]() Micrel, Inc. MIC2199. January 2010 13 M9999-011310 Decoupling Capacitor Selection The 4.7µF decoupling capacitor is used to minimize noise on the VDD pin. The placement of this capacitor is critical to the proper operation of the IC. It must be placed right next to the pins and routed with a wide trace. The capacitor should be a good quality tantalum. An additional 1µF ceramic capacitor maybenecessarywhendrivinglargeMOSFETswithhigh gate capacitance. Incorrect placement of the VDD decoupling capacitor will cause jitter or oscillations in the switching wave- form and large variations in the overcurrent limit. A 0.1µF ceramic capacitor is required to decouple the VIN. The capacitor should be placed near the IC and connected directly to between pin 6 (VIN) and pin 9 (GND). PCB Layout and Checklist PCBlayoutiscriticaltoachievereliable,stableandefficient performance.AgroundplaneisrequiredtocontrolEMIand minimize the inductance in power, signal and return paths. The following guidelines should be followed to insure proper operation of the circuit. • Signalandpowergroundsshouldbekeptseparate and connected at only one location. Large currents orhighdi/dtsignalsthatoccurwhentheMOSFETs turn on and off must be kept away from the small signal connections. • Theconnectionbetweenthecurrent-senseresis- tor and the MIC2199 current-sense inputs (pin 4 and 5) should have separate traces, through a 10Ωresistoroneachpin.Thetracesshouldbe routed as closely as possible to each other and their length should be minimized. Avoid running the traces under the inductor and other switching components.The10Ωresistorshouldbeplaced close as possible to pins 4 and 5 on the MIC2199 and a 1nF to 0.1µF capacitor placed between pins 4 and 5 will help attenuate switching noise on the current sense traces. This capacitor should be placed close to pins 4 and 5. • Whenthehigh-sideMOSFETisswitchedon,the criticalflowofcurrentisfromtheinputcapacitor through the MOSFET, inductor, sense resistor, output capacitor, and back to the input capacitor. These paths must be made with short, wide pieces of trace. It is good practice to locate the ground terminals of the input and output capacitors close to each. • Whenthelow-sideMOSFETisswitchedon,cur- rent flows through the inductor, sense resistor, outputcapacitor,andMOSFET.Thesourceofthe low-sideMOSFETshouldbelocatedclosetothe output capacitor. • Thefreewheelingdiode,D1inFigure2,conducts currentduringthedeadtime,whenbothMOSFETs are off. The anode of the diode should be located close to the output capacitor ground terminal and the cathode should be located close to the input side of the inductor. • The4.7µFcapacitor,whichconnectstotheVDD terminal (pin 7) must be located right at the IC. The VDDterminalisverynoisesensitiveandplacement of this capacitor is very critical. Connections must be made with wide trace. The capacitor may be located on the bottom layer of the board and con- nected to the IC with multiple vias. • TheVIN bypass capacitor should be located close to the IC and connected between pins 6 and 9. Connections should be made with a ground and power plane or with short, wide trace. |
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