CYONS2000

Document Number: 001-44044 Rev. *G

Page 28 of 36

Thermal Impedances

Solder Reflow Peak Temperature

Following is the minimum solder reflow peak temperature to achieve good solderability.

Package

Typical

42 PQFN[15]

24 °C/W

Package

Minimum Peak Temperature[16]

Maximum Peak Temperature

42 PQFN

240 °C

260 °C

Notes

15. To achieve the thermal impedance specified for the QFN package, the center thermal pad must be soldered to the PCB ground plane.

16. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste.

Refer to the solder manufacturer specifications. For a recommended soldering profile, refer to Application Note 49035, Manufacturing Considerations for the Ovation-

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