MAX9944 datasheet(2/15 Pages) MAXIM

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High-Voltage, Precision, Low-Power Op Amps

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ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Supply Voltage (VCC to VEE) ..................................-0.3V to +40V

All Other Pins (Note 1) .....................(VEE - 0.3V) to (VCC + 0.3V)

OUT Short-Circuit Current Duration

8-Pin μMAX (VCC - VEE ≤ 20V)...............................................3s

8-Pin μMAX (VCC - VEE > 20V) ................................Momentary

6-Pin TDFN (VCC - VEE ≤ 20V) .............................................60s

6-Pin TDFN (VCC - VEE > 20V)...............................................2s

8-Pin SO (VCC - VEE ≤ 20V) .................................................60s

8-Pin SO (VCC - VEE > 20V)...................................................2s

8-Pin TDFN (VCC - VEE ≤ 20V) .............................................60s

8-Pin TDFN (VCC - VEE > 20V)...............................................2s

Continuous Input Current (Any Pins) ................................±20mA

Thermal Limits (Note 2)

Multiple Layer PCB

Continuous Power Dissipation (TA = +70°C)

8-Pin μMAX (derate 4.8mW/°C above +70°C) ...........387.8mW

6-Pin TDFN-EP (derate 23.8mW/°C above +70°C) ..1904.8mW

8-Pin SO (derate 7.6mW/°C above +70°C)...................606.1W

8-Pin TDFN-EP (derate 24.4mW/°C above +70°C) ..1951.2mW

Operating Temperature Range .........................-40°C to +125°C

Junction Temperature ......................................................+150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC CHARACTERISTICS

Operating Supply Voltage Range

VSUPPLY

Guaranteed by PSRR test

±3

±19

Quiescent Supply Current per

Amplifier

ICC

550

950

μA

Power-Supply Rejection Ratio

PSRR

VS =

±3V to ±19V

105

130

TA = +25

°C

100

Input Offset Voltage

VOS

TA = -40

°C to +125°C

240

μV

Input Offset Voltage Drift

TCVOS

0.4

μV/

°C

VEE + 0.3V

≤ VCM ≤ VCC - 1.8V

Input Bias Current

IBIAS

VEE

≤ VCM ≤ VCC - 1.8V

Input Offset Current

IOS

VEE

≤ VCM ≤ VCC - 1.8V

Input Voltage Range

VIN+ , VIN-

Guaranteed by CMRR test,

TA = -40

°C to +125°C

VEE

VCC -

1.8

VEE + 0.3V

≤ VCM ≤ VCC - 1.8V

105

125

Common-Mode Rejection Ratio

CMRR

VEE

≤ VCM ≤ VCC - 1.8V

105

ELECTRICAL CHARACTERISTICS

(VCC = 15V, VEE = -15V, VCM = 0V, RL = 10kΩ to GND, VGND = 0V, TA = -40°C to +125°C. Typical values are at TA = +25°C, unless

otherwise noted.) (Note 3)

Note 1: Operation is limited by thermal limits.

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

8 μMAX

Junction-to-Ambient Thermal Resistance (

θJA)......206.3°C/W

Junction-to-Ambient Case Resistance (

θJC) ...............42°C/W

6 TDFN-EP

Junction-to-Ambient Thermal Resistance (

θJA)...........42°C/W

Junction-to-Ambient Case Resistance (

θJC) .................9°C/W

8 SO

Junction-to-Ambient Thermal Resistance (

θJA).........132°C/W

Junction-to-Ambient Case Resistance (

θJC) ...............38°C/W

8 TDFN-EP

Junction-to-Ambient Thermal Resistance (

θJA)...........41°C/W

Junction-to-Ambient Case Resistance (

θJC) .................8°C/W

PACKAGE THERMAL CHARACTERISTICS (Note 2)

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