TS9001

Page 8

TS9001DS r1p0

RTFDS

PACKAGE OUTLINE DRAWING

5-Pin SC70 Package Outline Drawing

(N.B., Drawings are not to scale)

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13

4

5

0.65 TYP.

2

1.30 TYP.

0.15 - 0.30

1.80 - 2.20

1.15 - 1.35

0.26 - 0.46

0.275 - 0.575

2

1

LEAD FRAME THICKNESS

GAUGE PLANE

1

2

NOTES:

DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

DOES NOT INCLUDE INTER-LEAD FLASH OR PROTRUSIONS.

DIE IS FACING UP FOR MOLDING. DIE IS FACING DOWN FOR TRIM/FORM.

3.

5.

CONTROLLING DIMENSIONS IN MILIMITERS.

ALL

SIDE

1.80 - 2.40

0.00 - 0.10

1.00

MAX

0.10 - 0.18

0.15

TYP.

8º - 12º

0º - 8º

0.800 – 0.925

0.40 – 0.55

4

ALL SPECIFICATION COMPLY TO JEDEC SPEC MO-203 AA

6.

ALL SPECIFICATIONS REFER TO JEDEC MO-203 AA

7. LEAD SPAN/STAND OFF HEIGHT/COPLANARITY ARE CONSIDERED AS SPECIAL CHARACTERISTIC

0.10 MAX