LPC4350 datasheet(89/145 Pages) NXP

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LPC4350_30_20_10

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Objective data sheet

Rev. 2.1 — 23 September 2011

89 of 145

NXP Semiconductors

LPC4350/30/20/10

32-bit ARM Cortex-M4/M0 microcontroller

Limiting values

[1]

The following applies to the limiting values:

a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive

static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated

maximum.

b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless

otherwise noted.

[2]

2.0 V if VBAT

 2.2 V.

[3]

Including voltage on outputs in 3-state mode; at 2.0 V the speed will be reduced.

[4]

The peak current is limited to 25 times the corresponding maximum current.

[5]

Dependent on package type.

[6]

Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k

 series resistor.

Table 6.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).[1]

Symbol

Parameter

Conditions

Min

Max

Unit

VDD(REG)(3V3)

regulator supply voltage (3.3 V)

on pin VDD_REG

2.2[2]

3.6

VDD(IO)

input/output supply voltage

on pin VDDIO

2.2

3.6

VDDA(3V3)

analog supply voltage (3.3 V)

on pin VDDA

2.0

3.6

VBAT

battery supply voltage

for the RTC

2.2

3.6

Vprog(pf)

polyfuse programming voltage

on pin VPP

2.7

3.6

input voltage

only valid when the

VDD(IO) supply voltage is

present

5 V tolerant I/O pins

(see Table 3)

[3]

0.5

5.5

ADC/DAC pins and

digital I/O pins

configured for an

analog function (see

Table 3)

<tbd>

VDDA(3V3)

USB1 pins USB1_DP

and USB1_DM (see

Table 3)

<tbd>

IDD

supply current

per supply pin

[4] -

<tbd>

ISS

ground current

per ground pin

[4] -

<tbd>

Ilatch

I/O latch-up current

(0.5V

DD(IO)) < VI <

(1.5VDD(IO));

Tj < 125 C

<tbd>

Tstg

storage temperature

[5] <tbd>

<tbd>

C

Ptot(pack)

total power dissipation (per

package)

based on package heat

transfer, not device power

consumption

<tbd>

VESD

electrostatic discharge voltage

human body model; all

pins

[6] <tbd>

<tbd>

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