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AM3359 Datasheet(PDF) 96 Page - Texas Instruments

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Part # AM3359
Description  AM335x ARM Cortex-A8 Microprocessors (MPUs)
PDF  162 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

AM3359 Datasheet(HTML) 96 Page - Texas Instruments

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AM335x
RTC_XTALIN
RTC_XTALOUT
C
1
C
2
Optional R
bias
Optional R
d
Crystal
AM3359, AM3358, AM3357
AM3356, AM3354, AM3352
SPRS717
– OCTOBER 2011
www.ti.com
A.
Oscillator components (Crystal, C1, C2, optional Rbias and Rd) must be located close to the AM335x package.
Parasitic capacitance to the printed circuit board (PCB) ground and other signals should be minimized to reduce noise
coupled into the oscillator.
B.
C1 and C2 represent the total capacitance of the respective PCB trace, load capacitor, and other components
(excluding the crystal) connected to each crystal terminal. The value of capacitors C1 and C2 should be selected to
provide the total load capacitance, CL, specified by the crystal manufacturer. The total load capacitance is CL =
[(C1*C2)/(C1+C2)] + Cshunt, where Cshunt is the crystal shunt capacitance (C0) specified by the crystal manufacturer
plus any mutual capacitance (Cpkg + CPCB) seen across the AM335x RTC_XTALIN and RTC_XTALOUT signals. For
recommended values of crystal circuit components, see Table 4-2.
Figure 4-8. OSC1 Crystal Circuit Schematic
Table 4-2. OSC1 Crystal Circuit Requirements
NAME
DESCRIPTION
MIN
TYP
MAX
UNIT
fxtal
Crystal parallel resonance
Fundamental mode oscillation only
32.768
kHz
frequency
Crystal frequency
Maximum RTC error = 10.512
-20.0
20.0
ppm
stability/tolerance
minutes/year
Maximum RTC error = 26.28
-50.0
50.0
ppm
minutes/year
CC1
C1 capacitance
12.0
24.0
pF
CC2
C2 capacitance
12.0
24.0
pF
Cshunt
Shunt capacitance
5.0
pF
ESR
Crystal effective series
fxtal = 32.768 kHz, oscillator has nominal
80
k
Ω
resistance
negative resistance of 725 k
Ω and
worst-case negative resistance of 250 k
Ω
4.2.2.4
OSC1 LVCMOS Digital Clock Source
Figure 4-9 shows the recommended oscillator connections when OSC1 is connected to an LVCMOS
square-wave digital clock source. The LVCMOS clock source is connected to the RTC_XTALIN terminal.
In this mode of operation, the RTC_XTALOUT terminal should not be used to source any external
components. The printed circuit board design should provide a mechanism to disconnect the
RTC_XTALOUT terminal from any external components or signal traces that may couple noise into OSC1
via the RTC_XTALOUT terminal.
The RTC_XTALIN terminal does not enable an internal pull-down resistor when OSC1 is disabled. If this
oscillator is disabled, the RTC_XTALIN terminal may float to an invalid logic level which may increase
leakage current through the oscillator input buffer. This should not be an issue for most applications that
use this oscillator to source the RTC clock since the RTC requires a continuous clock to maintain time.
96
Power and Clocking
Copyright
© 2011, Texas Instruments Incorporated
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www.ti.com: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352



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