xlamp xB-D leD solDering & hanDling

Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks

of Cree, Inc.

4

4

Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at

www.cree.com.

CirCuiT Board preparaTion & layouTS

Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before

placing or soldering XLamp XB-D LeDs onto the PCB.

The diagram below shows the recommended PCB solder pad layout for XLamp XB-D LeDs.

CaSe TemperaTure (T

XLamp XB-D LeD case temperature (T

possible. This measurement point is shown in the picture below.

It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XB-D LeD itself. In testing,

Cree has found such a solder pad to have insignificant impact on the resulting T

SIZE

TITLE

OF

REV.

SHEET

C

DRAWING NO.

DATE

DATE

DATE

CHECK

FINAL PROTECTIVE FINISH

MATERIAL

APPROVED

DRAWN BY

THIRD ANGLE PROJECTION

SCALE

A

B

C

D

1

2

3

4

5

6

6

5

4

3

2

1

A

B

C

D

Phone (919) 313-5300

Fax (919) 313-5558

4600 Silicon Drive

Durham, N.C 27703

UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT

MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY

CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT

CONTAINED WITHIN ARE THE PROPRIETARY AND

CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION

OF CREE INC.

NOTICE

X°

±

.5 °

.XXX ±

.25

.XX ±

.75

.X

±

1.5

FOR SHEET METAL PARTS ONLY

.XX ±

.25

.XXX ±

.125

X°

±

.5 °

UNLESS OTHERWISE SPECIFIED

DIMENSIONS ARE IN

MILLIMETERS AND AFTER FINISH.

TOLERANCE UNLESS SPECIFIED:

2.45

2.45

0.65

0.76

1.84

0.355

2.285

0.923

0.462

0.817

1.633

R1.086

0.82

0.36

0.46

2.34

0.36

0.28

0.36

0.92

2.34

2.272

1.136

2.272

0.284

0.284

0.426

0.852

0.426

0.284

1

/

1

30.000

A

2610-00019

2525 SBC HEW OUTLINE

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09/19/11

D. CRONIN

REVISONS

REV

DESCRIPTION

BY

DATE

APP'D

RECOMMENDED PCB SOLDER PAD

RECOMMENDED STENCIL PATTERN

(HATCHED AREA IS OPENING)

Recommended PCB Solder Pad

Recommended Stencil Pattern

Pad for thermocouple

Thermocouple site

if no separate pad

All dimensions in mm.