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AM3359 Datasheet(PDF) 82 Page - Texas Instruments

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Part # AM3359
Description  AM335x ARM짰 Cortex??A8 Microprocessors (MPUs)
PDF  197 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

AM3359 Datasheet(HTML) 82 Page - Texas Instruments

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AM3359, AM3358, AM3357
AM3356, AM3354, AM3352
SPRS717B
– OCTOBER 2011 – REVISED JANUARY 2012
www.ti.com
Table 3-4. Recommended Operating Conditions (continued)
PARAMETER
MIN
NOM
MAX
UNIT
SUPPLY NAME
DESCRIPTION
Voltage range for the USB ID
USB1_ID(4)
1.71
1.8
1.89
V
input
Commercial Temperature
0
90
Operating Temperature
Industrial Temperature
-40
90
°C
Range, Tj
Extended Temperature
-40
105
(1) Not available on the ZCE package. VDD_MPU is merged with VDD_CORE on the ZCE package.
(2) This supply is sourced from an internal LDO when RTC_KALDO_ENn is low. If RTC_KALDO_ENn is high, this supply must be sourced
from an external power supply.
(3) VDDS should be supplied irrespective of 1.8-V or 3.3-V mode of operation of the dual-voltage IOs.
(4) Not available on the ZCE package.
Table 3-5. Operating Performance Points for ZCZ Package(1)
OPP
VDD_MPU(2)
VDD_CORE(2)
ARM (A8)
DDR3(3)
DDR2(3)
mDDR(3)
L3/L4
Turbo
1.26 V
±4%
1.1 V
±4%
720 MHz
303 MHz(4)
266 MHz
200 MHz
200/100 MHz
OPP120
1.2 V
±4%
1.1 V
±4%
600 MHz
303 MHz(4)
266 MHz
200 MHz
200/100 MHz
OPP100
1.1 V
±4%
1.1 V
±4%
500 MHz
303 MHz(4)
266 MHz
200 MHz
200/100 MHz
OPP50
0.95 V
±4%
0.95 V
±4%
275 MHz
-
125 MHz
90 MHz
100/50 MHz
(1) Frequencies in this table indicate maximum performance for a given OPP condition.
(2) Interfaces in this row are validated and available on OPP50.
(3) This parameter represents the maximum memory clock frequency. Since data is transferred on both edges of the clock, double-data rate
(DDR), the maximum data rate is two times the maximum memory clock frequency defined in this table.
(4) The JEDEC JESD79-3E specification defines the maximum clock period of 3.3 ns for all standard speed bin DDR3 memory devices.
Therefore, all standard speed bin DDR3 memory devices are required to operate at 303 MHz.
Table 3-6. Operating Performance Points for ZCE Package(1)
OPP
VDD_CORE(2)
ARM (A8)
DDR3(3)
DDR2(3)
mDDR(3)
L3/L4
OPP100
1.1 V
±4%
500 MHz
303 MHz(4)
266 MHz
200 MHz
200/100 MHz
OPP50
0.95 V
±4%
275 MHz
-
125 MHz
90 MHz
100/50 MHz
(1) Frequencies in this table indicate maximum performance for a given OPP condition.
(2) Interfaces in this row are validated and available on OPP50.
(3) This parameter represents the maximum memory clock frequency. Since data is transferred on both edges of the clock, double-data rate
(DDR), the maximum data rate is two times the maximum memory clock frequency defined in this table.
(4) The JEDEC JESD79-3E specification defines the maximum clock period of 3.3 ns for all standard-speed bin DDR3 memory devices.
Therefore, all standard-speed bin DDR3 memory devices are required to operate at 303 MHz.
82
Device Operating Conditions
Copyright
© 2011–2012, Texas Instruments Incorporated
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Product Folder Link(s): AM3359 AM3358 AM3357 AM3356 AM3354 AM3352



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