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AM3359 Datasheet(PDF) 82 Page - Texas Instruments |
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AM3359 Datasheet(HTML) 82 Page - Texas Instruments |
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82 / 197 page ![]() AM3359, AM3358, AM3357 AM3356, AM3354, AM3352 SPRS717B – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com Table 3-4. Recommended Operating Conditions (continued) PARAMETER MIN NOM MAX UNIT SUPPLY NAME DESCRIPTION Voltage range for the USB ID USB1_ID(4) 1.71 1.8 1.89 V input Commercial Temperature 0 90 Operating Temperature Industrial Temperature -40 90 °C Range, Tj Extended Temperature -40 105 (1) Not available on the ZCE package. VDD_MPU is merged with VDD_CORE on the ZCE package. (2) This supply is sourced from an internal LDO when RTC_KALDO_ENn is low. If RTC_KALDO_ENn is high, this supply must be sourced from an external power supply. (3) VDDS should be supplied irrespective of 1.8-V or 3.3-V mode of operation of the dual-voltage IOs. (4) Not available on the ZCE package. Table 3-5. Operating Performance Points for ZCZ Package(1) OPP VDD_MPU(2) VDD_CORE(2) ARM (A8) DDR3(3) DDR2(3) mDDR(3) L3/L4 Turbo 1.26 V ±4% 1.1 V ±4% 720 MHz 303 MHz(4) 266 MHz 200 MHz 200/100 MHz OPP120 1.2 V ±4% 1.1 V ±4% 600 MHz 303 MHz(4) 266 MHz 200 MHz 200/100 MHz OPP100 1.1 V ±4% 1.1 V ±4% 500 MHz 303 MHz(4) 266 MHz 200 MHz 200/100 MHz OPP50 0.95 V ±4% 0.95 V ±4% 275 MHz - 125 MHz 90 MHz 100/50 MHz (1) Frequencies in this table indicate maximum performance for a given OPP condition. (2) Interfaces in this row are validated and available on OPP50. (3) This parameter represents the maximum memory clock frequency. Since data is transferred on both edges of the clock, double-data rate (DDR), the maximum data rate is two times the maximum memory clock frequency defined in this table. (4) The JEDEC JESD79-3E specification defines the maximum clock period of 3.3 ns for all standard speed bin DDR3 memory devices. Therefore, all standard speed bin DDR3 memory devices are required to operate at 303 MHz. Table 3-6. Operating Performance Points for ZCE Package(1) OPP VDD_CORE(2) ARM (A8) DDR3(3) DDR2(3) mDDR(3) L3/L4 OPP100 1.1 V ±4% 500 MHz 303 MHz(4) 266 MHz 200 MHz 200/100 MHz OPP50 0.95 V ±4% 275 MHz - 125 MHz 90 MHz 100/50 MHz (1) Frequencies in this table indicate maximum performance for a given OPP condition. (2) Interfaces in this row are validated and available on OPP50. (3) This parameter represents the maximum memory clock frequency. Since data is transferred on both edges of the clock, double-data rate (DDR), the maximum data rate is two times the maximum memory clock frequency defined in this table. (4) The JEDEC JESD79-3E specification defines the maximum clock period of 3.3 ns for all standard-speed bin DDR3 memory devices. Therefore, all standard-speed bin DDR3 memory devices are required to operate at 303 MHz. 82 Device Operating Conditions Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 |
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