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M538 Datasheet(PDF) 8 Page - M/A-COM Technology Solutions, Inc. |
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M538 Datasheet(HTML) 8 Page - M/A-COM Technology Solutions, Inc. |
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8 / 8 page ![]() Surface Mounting Instructions Rev. V6 Application Note M538 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 8 Figure 1. Reflow Profile Table 3 Pb-Free Process - Classification Temperature (TC) Package Thickness Volume mm3 <350 Volume mm3 350-2000 Volume mm3 >2000 <1.6 mm 260°C 260°C 260°C 1.6 mm-2.5 mm 260°C 250°C 245°C >2.5 mm 250°C 245°C 245°C Note 1: At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (Tp) can exceed the values specified in Tables 2 or 3. The use of a higher Tp does not change the classification temperature (Tc). Note 2: Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks. Note 3: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. Note 4: Moisture sensitivity levels of components intended for use in a Pb-free assembly process shall be evaluated using the Pb-free classification temperatures and profiles defined in Tables 1 and 3, whether or not Pb-free. Note 5: SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020, JESD22-A112 (rescinded), IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in classification level or a higher peak classification temperature is desired |
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